18084994. ELECTRONIC DEVICE INCLUDING THERMOSETTING BONDING SHEET simplified abstract (Samsung Electronics Co., Ltd.)

ELECTRONIC DEVICE INCLUDING THERMOSETTING BONDING SHEET

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Youngsun Lee of Suwon-si (KR)

Dohyeon Kim of Suwon-si (KR)

Byeongkeol Kim of Suwon-si (KR)

Jinsu Kim of Suwon-si (KR)

Seokjoon Park of Suwon-si (KR)

Jungje Bang of Suwon-si (KR)

Hoyeon Seo of Suwon-si (KR)

Jongbum Lee of Suwon-si (KR)

Jongmin Jeon of Suwon-si (KR)

ELECTRONIC DEVICE INCLUDING THERMOSETTING BONDING SHEET - A simplified explanation of the abstract

This abstract first appeared for US patent application 18084994 titled 'ELECTRONIC DEVICE INCLUDING THERMOSETTING BONDING SHEET

Simplified Explanation

The abstract describes an electronic device that includes a thermosetting bonding sheet. The device consists of a base substrate with base pads, a connection substrate with connection pads and connection lines, and a solder that connects the base pad to the connection pad. The thermosetting bonding sheet is placed between the base and connection substrates and encloses the solder.

• The electronic device includes a base substrate with base pads and a connection substrate with connection pads and lines.
• A solder is used to electrically connect the base pad to the connection pad.
• A thermosetting bonding sheet is placed between the base and connection substrates and encloses the solder.

Potential Applications

• This technology can be used in various electronic devices such as smartphones, tablets, and computers.
• It can be applied in the manufacturing of circuit boards and other electronic components.

Problems Solved

• The thermosetting bonding sheet provides a secure and reliable connection between the base and connection substrates.
• It helps to protect the solder and prevent any damage or disconnection.

Benefits

• The use of a thermosetting bonding sheet improves the overall durability and reliability of the electronic device.
• It ensures a strong and stable connection between the base and connection substrates.
• The enclosed solder is protected from external factors such as moisture or physical stress.

Original Abstract Submitted

An electronic device including a thermosetting bonding sheet may include: a base substrate including a base substrate body and a plurality of base pads disposed on the base substrate body, a connection substrate including a connection substrate body facing the base substrate body, a plurality of connection pads disposed on the connection substrate body and including a pad hole, and a plurality of connection lines disposed on the connection substrate body and connected to the plurality of connection pads, a solder, at least a portion of which is inserted into the pad hole, disposed on the base pad and configured to electrically connect the base pad to the connection pad, and a thermosetting bonding sheet provided between the base substrate body and the connection substrate body, bonded to the base substrate body and the connection substrate body, and enclosing the solder