18084360. Thermoelectric Cooling Modules simplified abstract (APPLE INC.)
Contents
Thermoelectric Cooling Modules
Organization Name
Inventor(s)
Miikka M. Kangas of Campbell CA (US)
Thermoelectric Cooling Modules - A simplified explanation of the abstract
This abstract first appeared for US patent application 18084360 titled 'Thermoelectric Cooling Modules
Simplified Explanation
The abstract describes thermoelectric cooling modules that consist of two substrates stacked vertically and connected by a thermoelectric connector. The connector transfers heat laterally to enhance heat transfer between the substrates.
- The thermoelectric cooling modules consist of two substrates stacked vertically.
- A thermoelectric connector is used to thermally connect the two substrates.
- The thermoelectric connector transfers heat laterally, improving heat transfer between the substrates.
Potential Applications
- Cooling electronic devices such as computer chips or power modules.
- Cooling components in automotive systems, such as batteries or power electronics.
- Cooling medical equipment or laboratory instruments.
Problems Solved
- Inefficient heat transfer between stacked substrates.
- Overheating of electronic components.
- Inadequate cooling of high-power systems.
Benefits
- More efficient heat transfer between stacked substrates.
- Improved cooling performance for electronic devices.
- Enhanced reliability and longevity of components.
- Compact design for space-constrained applications.
Original Abstract Submitted
Various embodiments disclosed herein describe thermoelectric cooling modules. The thermoelectric cooling modules may include a first substrate positioned over a second substrate in a vertical stacking direction, and may include a thermoelectric connector that thermally connects the first and second substrates. The thermoelectric connector may be configured to transfer heat laterally relative to the vertical stacking direction to provide more efficient heat transfer between the first substrate and the second substrate.
