18083994. STRESS MODULATING PATTERN CONTAINING BONDING DIELECTRIC LAYER simplified abstract (International Business Machines Corporation)
Contents
STRESS MODULATING PATTERN CONTAINING BONDING DIELECTRIC LAYER
Organization Name
International Business Machines Corporation
Inventor(s)
Hosadurga Shobha of Niskayuna NY (US)
Michael Rizzolo of Delmar NY (US)
Aakrati Jain of Albany NY (US)
Sagarika Mukesh of ALBANY NY (US)
Christopher J. Waskiewicz of Rexford NY (US)
STRESS MODULATING PATTERN CONTAINING BONDING DIELECTRIC LAYER - A simplified explanation of the abstract
This abstract first appeared for US patent application 18083994 titled 'STRESS MODULATING PATTERN CONTAINING BONDING DIELECTRIC LAYER
Simplified Explanation: The patent application describes a semiconductor structure with a stress modulating pattern containing a bonding dielectric layer, which can be used to modulate warpage in wafers and device-containing regions.
Key Features and Innovation:
- Stress modulating pattern with bonding dielectric layer
- Composed of patterned structures embedded in the dielectric layer
- Modulates warpage in wafers and device-containing regions
Potential Applications: This technology can be applied in the semiconductor industry for manufacturing processes where controlling warpage is crucial, such as in the production of integrated circuits and electronic devices.
Problems Solved: The technology addresses the issue of warpage in semiconductor structures, which can affect the performance and reliability of electronic devices.
Benefits:
- Improved control over warpage in semiconductor structures
- Enhanced performance and reliability of electronic devices
- Potential cost savings in manufacturing processes
Commercial Applications: The technology could be utilized in the production of various electronic devices, including smartphones, computers, and automotive electronics, to ensure better performance and longevity.
Prior Art: Readers can explore prior research on stress modulation in semiconductor structures and the use of bonding dielectric layers in wafer manufacturing processes.
Frequently Updated Research: Stay informed about the latest advancements in stress modulation techniques in semiconductor manufacturing and the development of new materials for bonding dielectric layers.
Questions about Semiconductor Stress Modulation: 1. How does stress modulation impact the performance of electronic devices? 2. What are the potential challenges in implementing stress modulating patterns in semiconductor manufacturing processes?
Original Abstract Submitted
A semiconductor structure is provided that includes a stress modulating pattern containing bonding dielectric layer. The stress modulating pattern containing bonding dielectric layer can be formed on a wafer, on a device-containing region that is present on a device wafer, or both a wafer and a device-containing region that is present on a device wafer. The stress modulating pattern is composed of a plurality of patterned structures (metal and/or dielectric) that are embedded at least partially within a bonding dielectric layer. Warpage modulation can be achieved using such a stress modulating pattern containing bonding dielectric layer.
