18083851. PHYSICALLY DETECTABLE ID INTRODUCED BY LITHOGRAPHY SRAF INSERTION FOR HETEROGENEOUS INTEGRATION simplified abstract (International Business Machines Corporation)
Contents
PHYSICALLY DETECTABLE ID INTRODUCED BY LITHOGRAPHY SRAF INSERTION FOR HETEROGENEOUS INTEGRATION
Organization Name
International Business Machines Corporation
Inventor(s)
Cheng Chi of Jersey City NJ (US)
Takashi Ando of Eastchester NY (US)
Praneet Adusumilli of Somerset NJ (US)
Reinaldo Vega of Mahopac NY (US)
David Wolpert of Poughkeepsie NY (US)
PHYSICALLY DETECTABLE ID INTRODUCED BY LITHOGRAPHY SRAF INSERTION FOR HETEROGENEOUS INTEGRATION - A simplified explanation of the abstract
This abstract first appeared for US patent application 18083851 titled 'PHYSICALLY DETECTABLE ID INTRODUCED BY LITHOGRAPHY SRAF INSERTION FOR HETEROGENEOUS INTEGRATION
The patent application describes a system and method for intentionally distorting a feature of a pattern using sub-resolution assist features (SRAF) for identification and security purposes in semiconductor manufacturing.
- Leveraging sub-resolution assist features (SRAF) to intentionally distort a feature of a pattern for identification and security purposes.
- Designing a lithographic mask structure with main features and SRAF structures to create a uniquely modified identifier pattern.
- Employing a lithography process to transfer the modified identifier pattern to a semiconductor wafer surface.
- Enhancing security and identification capabilities in semiconductor structures.
- Utilizing advanced lithographic techniques for creating unique identifier patterns.
Potential Applications: This technology can be applied in the semiconductor industry for enhancing security features in electronic devices, authentication purposes, and anti-counterfeiting measures.
Problems Solved: The technology addresses the need for improved identification and security measures in semiconductor structures to prevent counterfeiting and unauthorized access.
Benefits: Enhanced security features, improved identification capabilities, and increased protection against counterfeiting in semiconductor manufacturing processes.
Commercial Applications: Title: Advanced Security Features in Semiconductor Manufacturing This technology can be commercially used in electronic device manufacturing, secure document production, and authentication systems for various industries.
Prior Art: Researchers can explore prior patents related to lithographic techniques, semiconductor security features, and anti-counterfeiting measures in the semiconductor industry.
Frequently Updated Research: Researchers are constantly developing new methods and technologies to enhance security features in semiconductor manufacturing, including advancements in lithographic processes and pattern distortion techniques.
Questions about the Technology: 1. How does this technology improve security in semiconductor manufacturing processes? 2. What are the potential applications of this technology in different industries?
Original Abstract Submitted
A system and method of leveraging sub-resolution assist feature (SRAF) to intentionally distort a feature of a pattern for identification and security purposes. A method of forming an identifier on a semiconductor structure includes: receiving, at a semiconductor manufacturing foundry, a specification of an identifier including a pattern comprising a combination of main features; designing a lithographic mask structure based on the received identifier specification, the lithographic mask structure including mask features corresponding to the specified main features and at least one sub-resolution assist feature (SRAF) structure in a geometrical relationship with a corresponding mask feature for forming, using a lithography process, a uniquely modified identifier pattern comprising a combination of modified main features; and then subsequently lithographically exposing, employing the mask structure, photoresist layers at an optical condition and subsequently developing the photoresist layers to transfer the uniquely modified identifier pattern to a surface of a semiconductor wafer.
