18083554. THERMAL EXPANSION MATCHED CHIP MODULE WITH INTEGRATED LIQUID COOLING simplified abstract (International Business Machines Corporation)

THERMAL EXPANSION MATCHED CHIP MODULE WITH INTEGRATED LIQUID COOLING

Organization Name

International Business Machines Corporation

Inventor(s)

Evan Colgan of Montvale NJ (US)

Jae-Woong Nah of Closter NJ (US)

Katsuyuki Sakuma of Fishkill NY (US)

Kamal K. Sikka of Poughkeepsie NY (US)

Joshua M. Rubin of Albany NY (US)

Frank Robert Libsch of White Plains NY (US)

THERMAL EXPANSION MATCHED CHIP MODULE WITH INTEGRATED LIQUID COOLING - A simplified explanation of the abstract

This abstract first appeared for US patent application 18083554 titled 'THERMAL EXPANSION MATCHED CHIP MODULE WITH INTEGRATED LIQUID COOLING

The patent application describes a chip and cooler assembly that includes an interposer with integrated circuit chips mounted on the back side, a frame fitted into the gaps between the chips, and a cooler module attached to the back side surface.

• Integrated circuit chips are mounted onto the back side of the interposer.
• Gaps separate the chips, and a frame is fitted into these gaps.
• The frame is CTE-matched to the chips and defines a back side surface.
• A cooler module, CTE-matched to the chips, is attached to the back side surface.
• The cooler module includes a microchannel cooler directly against the chips and a manifold attached to the microchannel cooler.

Potential Applications: - High-performance computing systems - Data centers - Telecommunications equipment

Problems Solved: - Efficient cooling of integrated circuit chips - Improved thermal management in densely packed chip assemblies

Benefits: - Enhanced performance and reliability of electronic devices - Extended lifespan of integrated circuit chips - Reduced risk of overheating and thermal damage

Commercial Applications: Title: "Advanced Cooling Solutions for High-Performance Electronics" This technology can be utilized in servers, supercomputers, and other high-performance computing systems to improve thermal management and overall system efficiency.

Prior Art: Researchers can explore prior patents related to interposer technologies, chip cooling solutions, and thermal management in electronic devices.

Frequently Updated Research: Researchers are continually developing new cooling technologies for electronic devices to address the increasing demand for high-performance computing.

Questions about Chip and Cooler Assembly: 1. How does the frame contribute to the thermal management of the integrated circuit chips? 2. What are the advantages of using a microchannel cooler in this assembly?

Original Abstract Submitted

A chip and cooler assembly includes an active or passive interposer that has a front side and a back side. Integrated circuit chips are mounted onto the back side of the interposer. Each of the chips has a front side that is attached to the interposer and a back side that faces away from the interposer. Gaps separate the chips. The assembly also includes a frame that is fitted into the gaps between the chips. The frame is CTE-matched to the chips. The frame and the chips define a back side surface. A cooler module is attached to the back side surface. The cooler module is CTE-matched to the chips. The cooler module includes a microchannel cooler that is disposed directly against the back sides of the chips and a manifold that is attached to the microchannel cooler opposite the chips. The manifold is CTE-matched to the microchannel cooler.