18083380. DIELECTRIC FILLED ALIGNMENT MARK STRUCTURES simplified abstract (International Business Machines Corporation)
Contents
DIELECTRIC FILLED ALIGNMENT MARK STRUCTURES
Organization Name
International Business Machines Corporation
Inventor(s)
Somnath Ghosh of Clifton Park NY (US)
Ruilong Xie of Niskayuna NY (US)
Kisik Choi of Watervliet NY (US)
DIELECTRIC FILLED ALIGNMENT MARK STRUCTURES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18083380 titled 'DIELECTRIC FILLED ALIGNMENT MARK STRUCTURES
The semiconductor structure described in the patent application consists of a handler substrate and a device substrate bonded to it. The handler substrate features a trench with at least one alignment mark at the bottom. Dielectric layers are placed in the trench and on the alignment mark.
- The semiconductor structure includes a handler substrate and a device substrate bonded together.
- The handler substrate has a trench with at least one alignment mark at the bottom.
- Dielectric layers are positioned within the trench and on the alignment mark.
Potential Applications: - Semiconductor manufacturing - Integrated circuit production - Microelectronics industry
Problems Solved: - Improved alignment accuracy in semiconductor structures - Enhanced bonding between substrates - Facilitates the manufacturing process of electronic devices
Benefits: - Increased precision in semiconductor fabrication - Enhanced device performance - Streamlined production processes
Commercial Applications: Title: Advanced Semiconductor Bonding Technology for Enhanced Device Performance This technology can be utilized in the production of various electronic devices, such as smartphones, computers, and other consumer electronics. It can also benefit industries involved in semiconductor manufacturing and microelectronics.
Questions about the technology: 1. How does the alignment mark in the trench contribute to the overall precision of the semiconductor structure? - The alignment mark helps ensure accurate positioning of the dielectric layers, leading to improved alignment and bonding between substrates. 2. What are the potential cost-saving benefits of implementing this semiconductor structure in manufacturing processes? - By enhancing alignment accuracy and bonding efficiency, this technology can reduce production costs and improve overall yield rates.
Original Abstract Submitted
A semiconductor structure includes a handler substrate and a device substrate bonded to the handler substrate. The handler substrate comprises a trench, and at least one alignment mark in a bottom surface of the trench. One or more dielectric layers are disposed in the trench and on the at least one alignment mark.
