18081589. INTEGRATED CIRCUIT BUMP INTEGRATED WITH TCOIL simplified abstract (QUALCOMM Incorporated)
Contents
INTEGRATED CIRCUIT BUMP INTEGRATED WITH TCOIL
Organization Name
Inventor(s)
Hongmei Liao of San Diego CA (US)
Xiaohua Kong of San Diego CA (US)
INTEGRATED CIRCUIT BUMP INTEGRATED WITH TCOIL - A simplified explanation of the abstract
This abstract first appeared for US patent application 18081589 titled 'INTEGRATED CIRCUIT BUMP INTEGRATED WITH TCOIL
The abstract describes an integrated circuit (IC) with an IC bump and a Tcoil positioned directly below the IC bump, where the Tcoil is connected to the IC bump through a metallized via hole.
- The integrated circuit features an IC bump and a Tcoil situated beneath it.
- The Tcoil is electrically linked to the IC bump via a metallized via hole.
Potential Applications:
- This technology could be used in various electronic devices requiring compact and efficient circuitry.
Problems Solved:
- Enables a direct electrical connection between the IC bump and Tcoil, improving overall circuit performance.
Benefits:
- Enhances the functionality and efficiency of integrated circuits.
- Facilitates the design of smaller and more powerful electronic devices.
Commercial Applications:
- This innovation could be applied in the development of advanced consumer electronics, medical devices, and communication systems.
Questions about the technology: 1. How does the direct electrical coupling between the IC bump and Tcoil improve circuit performance? 2. What are the specific advantages of using a metallized via hole for connecting the Tcoil to the IC bump?
Original Abstract Submitted
An integrated circuit (IC) including an IC bump; and a Tcoil situated directly below the IC bump, wherein the Tcoil is electrically coupled to the IC bump by way of a metallized via hole.
