18080729. MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION simplified abstract (Google LLC)
Contents
MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION
Organization Name
Inventor(s)
Zhimin Jamie Yao of Santa Barbara CA (US)
Michael C. Hamilton of Auburn AL (US)
Marissa Giustina of Santa Barbara CA (US)
Brian James Burkett of Santa Barbara CA (US)
Theodore Charles White of Santa Barbara CA (US)
Ofer Naaman of Santa Barbara CA (US)
MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION - A simplified explanation of the abstract
This abstract first appeared for US patent application 18080729 titled 'MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION
Simplified Explanation: The patent application describes a method involving a first chip with multiple circuit elements distributed across different layers, separated by sacrificial material. A coherent device layer is placed on top of the circuit element layer stack, and the sacrificial material is then removed.
- Key Features and Innovation:
- Method involves a circuit element layer stack with sacrificial material. - Coherent device layer is added on top of the stack. - Sacrificial material removal process is included in the method.
Potential Applications: This technology could be applied in semiconductor manufacturing processes, integrated circuit design, and microelectronics production.
Problems Solved: This method addresses the challenge of integrating multiple circuit elements across different layers while maintaining coherence and functionality.
Benefits: - Enables efficient stacking of circuit elements. - Facilitates the creation of complex integrated circuits. - Improves the overall performance of electronic devices.
Commercial Applications: The technology could be utilized in the production of advanced electronic devices, such as smartphones, tablets, and computers, enhancing their performance and functionality.
Prior Art: Readers can explore prior art related to this technology in the field of semiconductor manufacturing, integrated circuit design, and microelectronics research.
Frequently Updated Research: Stay informed about the latest advancements in semiconductor manufacturing processes, integrated circuit design, and microelectronics production to enhance your understanding of this technology.
Questions about the Technology: 1. What are the potential challenges in implementing this method in large-scale semiconductor manufacturing? 2. How does the removal of sacrificial material impact the overall performance and reliability of the electronic devices?
Original Abstract Submitted
A method includes providing a first chip having a circuit element layer stack, the circuit element layer stack including a plurality of circuit elements distributed across a plurality of layers. The circuit element layer stack has a sacrificial material filling a space between the plurality of circuit elements in the plurality of layers and a coherent device layer disposed on the circuit element layer stack. The method includes removing the sacrificial material.
