18080715. MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION simplified abstract (Google LLC)

MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION

Organization Name

Google LLC

Inventor(s)

Zhimin Jamie Yao of Santa Barbara CA (US)

Michael C. Hamilton of Auburn AL (US)

Marissa Giustina of Santa Barbara CA (US)

Brian James Burkett of Santa Barbara CA (US)

Theodore Charles White of Santa Barbara CA (US)

Ofer Naaman of Santa Barbara CA (US)

MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION - A simplified explanation of the abstract

This abstract first appeared for US patent application 18080715 titled 'MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION

Simplified Explanation: The patent application describes a method involving a first chip with multiple circuit elements distributed across different layers, separated by sacrificial material. A coherent device layer is placed on top of the circuit element layer stack, and the sacrificial material is then removed.

• **Key Features and Innovation:**

   - Utilizes sacrificial material to fill space between circuit elements in different layers.
   - Enables the creation of a coherent device layer on top of the circuit element layer stack.
   - Involves a method for removing the sacrificial material efficiently.

Potential Applications: This technology could be applied in the semiconductor industry for the fabrication of advanced integrated circuits, sensors, and other electronic devices.

Problems Solved: - Facilitates the integration of multiple circuit elements in different layers. - Enables the creation of a coherent device layer on top of the circuit element layer stack.

Benefits: - Improved efficiency in the fabrication process. - Enhanced performance of integrated circuits and electronic devices. - Enables the development of more complex and compact electronic systems.

Commercial Applications: The technology could be utilized in the production of high-performance electronic devices, such as smartphones, computers, and IoT devices, enhancing their functionality and reliability.

Prior Art: Readers can explore prior art related to sacrificial material in semiconductor fabrication processes to understand the evolution of this technology.

Frequently Updated Research: Stay updated on the latest advancements in semiconductor fabrication processes and the integration of sacrificial materials in electronic device manufacturing.

Questions about Semiconductor Fabrication with Sacrificial Material: 1. What are the environmental implications of using sacrificial material in semiconductor fabrication? 2. How does the removal of sacrificial material impact the overall performance of electronic devices?

Original Abstract Submitted

A method includes providing a first chip having a circuit element layer stack, the circuit element layer stack including a plurality of circuit elements distributed across a plurality of layers. The circuit element layer stack has a sacrificial material filling a space between the plurality of circuit elements in the plurality of layers and a coherent device layer disposed on the circuit element layer stack. The method includes removing the sacrificial material.