18078416. Integrated process sequence for hybrid bonding applications simplified abstract (Applied Materials, Inc.)
Contents
- 1 Integrated process sequence for hybrid bonding applications
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 Integrated process sequence for hybrid bonding applications - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Commercial Applications
- 1.9 Prior Art
- 1.10 Frequently Updated Research
- 1.11 Questions about Hybrid Bonding Process Sequencing Method
- 1.12 Original Abstract Submitted
Integrated process sequence for hybrid bonding applications
Organization Name
Inventor(s)
Niranjan Pingle of Milpitas CA (US)
Jitendra Ratilal Bhimjiyani of Santa Clara CA (US)
Shreshtha Kumar Jaiswal of Kalispell MT (US)
Integrated process sequence for hybrid bonding applications - A simplified explanation of the abstract
This abstract first appeared for US patent application 18078416 titled 'Integrated process sequence for hybrid bonding applications
Simplified Explanation
This patent application describes a method for sequencing a hybrid bonding process by double linking a source of dies and a target. The process involves selecting a source of dies and a target, linking them together, determining process timing, and bonding a die from the source to the target.
- Select a source of dies and a target for bonding.
- Link the source to the target and the target to the source.
- Form an integrated bonding product sequence with linked bonding sequences for the source and target.
- Determine bonding process chamber allocations and timing based on the integrated sequence.
- Bond a die from the source to the target using the integrated bonding product sequence.
Potential Applications
The technology can be applied in semiconductor manufacturing, microelectronics, and integrated circuit production.
Problems Solved
This method streamlines the bonding process, improves efficiency, and enhances the precision of die bonding.
Benefits
The method optimizes the bonding process, reduces errors, and increases the overall quality of bonded products.
Commercial Applications
"Hybrid Bonding Process Sequencing Method for Semiconductor Manufacturing" can be utilized in the semiconductor industry for advanced packaging solutions, microelectronic devices, and integrated circuit production.
Prior Art
Further research can be conducted on hybrid bonding processes, semiconductor manufacturing techniques, and die bonding methods to explore related prior art.
Frequently Updated Research
Stay updated on advancements in semiconductor manufacturing, hybrid bonding technologies, and integrated circuit packaging methods for the latest developments in the field.
Questions about Hybrid Bonding Process Sequencing Method
What are the key advantages of using this method in semiconductor manufacturing?
The method improves efficiency, precision, and quality in die bonding processes, leading to enhanced overall product performance.
How does this method compare to traditional die bonding techniques?
This method offers a more streamlined and precise approach to die bonding, reducing errors and optimizing the overall bonding process.
Original Abstract Submitted
A method for sequencing a hybrid bonding process by double linking a source of dies and a target. The method may include selecting a source of dies for bonding, selecting a target on which the dies will be bonded, linking the source to the target, linking the target to the source, forming an integrated bonding product sequence that includes a first linked bonding sequence for the source and a second linked bonding sequence for the target, determining bonding process chamber allocations and process timing for the source and the target based on the integrated bonding product sequence, and bonding a die from the source to the target using the integrated bonding product sequence.
