18078302. APPARATUS AND METHODS FOR PROCESSING BONDING SEMICONDUCTOR WAFERS simplified abstract (Tokyo Electron Limited)
Contents
APPARATUS AND METHODS FOR PROCESSING BONDING SEMICONDUCTOR WAFERS
Organization Name
Inventor(s)
Satohiko Hoshino of Albany NY (US)
Scott Lefevre of Albany NY (US)
APPARATUS AND METHODS FOR PROCESSING BONDING SEMICONDUCTOR WAFERS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18078302 titled 'APPARATUS AND METHODS FOR PROCESSING BONDING SEMICONDUCTOR WAFERS
Simplified Explanation: The patent application describes a method for manufacturing semiconductor devices by using a plasma that does not contain fluorine to release fluorine on the surface of a semiconductor wafer.
- The method involves placing a semiconductor wafer in a chamber.
- A plasma without fluorine is applied in the chamber.
- The plasma causes components with a fluorinated coating to release fluorine on the wafer's surface.
Key Features and Innovation:
- Use of a plasma without fluorine in semiconductor device manufacturing.
- Controlled release of fluorine on the semiconductor wafer surface.
- Improved semiconductor device performance and reliability.
Potential Applications:
- Semiconductor manufacturing industry.
- Electronics and technology sector.
- Research and development in materials science.
Problems Solved:
- Enhancing the performance of semiconductor devices.
- Improving the reliability of semiconductor components.
- Addressing challenges in semiconductor manufacturing processes.
Benefits:
- Increased efficiency in semiconductor device production.
- Enhanced performance and reliability of semiconductor devices.
- Potential cost savings in manufacturing processes.
Commercial Applications: Title: "Innovative Method for Semiconductor Device Manufacturing" This technology can be applied in the semiconductor industry for the production of high-performance electronic devices, leading to improved market competitiveness and potential growth opportunities in the electronics sector.
Prior Art: Readers can explore prior research on plasma technologies in semiconductor manufacturing processes to understand the evolution of similar methods and technologies in the industry.
Frequently Updated Research: Stay informed about the latest advancements in plasma technologies and semiconductor manufacturing processes to leverage cutting-edge innovations in the field.
Questions about Semiconductor Device Manufacturing: 1. How does the use of a plasma without fluorine impact the semiconductor manufacturing process? 2. What are the potential long-term benefits of implementing this innovative method in semiconductor device production?
Original Abstract Submitted
A method for manufacturing semiconductor devices. The method includes placing a semiconductor wafer in a chamber. The method includes applying, in the chamber, a plasma that contains no fluorine. The plasma causes one or more components, in contact with the chamber, that each comprise a fluorinated coating to release its fluorine on a surface of the semiconductor wafer.
