18076725. LEARNING BASED TUNING IN A RADIO FREQUENCY PLASMA PROCESSING CHAMBER simplified abstract (Applied Materials, Inc.)
Contents
- 1 LEARNING BASED TUNING IN A RADIO FREQUENCY PLASMA PROCESSING CHAMBER
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 LEARNING BASED TUNING IN A RADIO FREQUENCY PLASMA PROCESSING CHAMBER - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Prior Art
- 1.11 Frequently Updated Research
- 1.12 Questions about Plasma Processing Technology
- 1.13 Original Abstract Submitted
LEARNING BASED TUNING IN A RADIO FREQUENCY PLASMA PROCESSING CHAMBER
Organization Name
Inventor(s)
Yue Guo of Redwood City CA (US)
Kartik Ramaswamy of San Jose CA (US)
Yang Yang of San Diego CA (US)
LEARNING BASED TUNING IN A RADIO FREQUENCY PLASMA PROCESSING CHAMBER - A simplified explanation of the abstract
This abstract first appeared for US patent application 18076725 titled 'LEARNING BASED TUNING IN A RADIO FREQUENCY PLASMA PROCESSING CHAMBER
Simplified Explanation
The patent application describes a method for processing a substrate in a plasma processing system by tuning capacitors and frequencies to match different impedances at different stages of a waveform.
- Tuning capacitors and frequencies to match impedances at different stages of a waveform
- Recording setting values for different impedances at different stages
- Switching between frequencies to match impedances at different stages
Key Features and Innovation
- Method for tuning capacitors and frequencies to match impedances at different stages of a waveform
- Ability to switch between frequencies to match different impedances
- Optimization of processing in a plasma processing system
Potential Applications
This technology can be applied in semiconductor manufacturing, thin film deposition, and other plasma processing applications.
Problems Solved
- Inefficient processing due to mismatched impedances
- Lack of control over different stages of the waveform
- Difficulty in optimizing plasma processing systems
Benefits
- Improved processing efficiency
- Enhanced control over different stages of the waveform
- Optimization of plasma processing systems
Commercial Applications
- Semiconductor manufacturing industry
- Thin film deposition industry
- Plasma processing equipment manufacturers
Prior Art
Prior art related to this technology can be found in patents related to plasma processing systems, impedance matching, and radio frequency generators.
Frequently Updated Research
Research on impedance matching techniques in plasma processing systems and advancements in radio frequency generator technology are relevant to this technology.
Questions about Plasma Processing Technology
How does this technology improve processing efficiency in plasma processing systems?
This technology improves processing efficiency by tuning capacitors and frequencies to match impedances at different stages of a waveform, optimizing the overall process.
What are the potential applications of this technology beyond semiconductor manufacturing?
This technology can also be applied in thin film deposition, surface modification, and other plasma processing applications.
Original Abstract Submitted
Some embodiments are directed to a method of processing a substrate in a plasma processing system. The method generally includes tuning a first capacitor and a second capacitor of a tuning circuit to match a first impedance corresponding to a first stage of a waveform, while a frequency of a radio frequency (RF) generator is preset to a first frequency; tuning a third capacitor of the tuning circuit and the frequency of the RF generator to match a second impedance corresponding to a second stage of the waveform, wherein the frequency of the RF generator is tuned to a second frequency; recording setting values of the first frequency and the second frequency that match different impedances at different stages of the waveform; and switching between the first frequency and the second frequency to match the different impedances at the different stages of the waveform.
