18074385. Heated Pedestal With Impedance Matching Radio Frequency (RF) Rod simplified abstract (Applied Materials, Inc.)
Contents
- 1 Heated Pedestal With Impedance Matching Radio Frequency (RF) Rod
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 Heated Pedestal With Impedance Matching Radio Frequency (RF) Rod - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Prior Art
- 1.11 Frequently Updated Research
- 1.12 Questions about Substrate Supports for Process Chambers
- 1.13 Original Abstract Submitted
Heated Pedestal With Impedance Matching Radio Frequency (RF) Rod
Organization Name
Inventor(s)
Yao-Hung Yang of Santa Clara CA (US)
Chih-Yang Chang of Santa Clara CA (US)
Yikai Chen of Santa Clara CA (US)
Rongping Wang of Cupertino CA (US)
Heated Pedestal With Impedance Matching Radio Frequency (RF) Rod - A simplified explanation of the abstract
This abstract first appeared for US patent application 18074385 titled 'Heated Pedestal With Impedance Matching Radio Frequency (RF) Rod
Simplified Explanation
This patent application describes substrate supports for process chambers with specific features to improve performance.
- The substrate support includes a pedestal with heating elements and an RF electrode, a hollow shaft, and an RF rod with low impedance.
- The RF rod's impedance is less than 0.2 ohms, enhancing the efficiency of the RF electrode in the process chamber.
Key Features and Innovation
- Substrate support with heating elements and RF electrode for improved substrate processing.
- Hollow shaft design for structural support and RF rod coupling.
- Low impedance RF rod for enhanced RF electrode performance.
Potential Applications
This technology can be used in semiconductor manufacturing, thin film deposition, and other processes requiring precise substrate heating and RF energy transfer.
Problems Solved
- Enhanced substrate processing efficiency.
- Improved uniformity and control of substrate temperature.
- Increased reliability and longevity of process chamber components.
Benefits
- Higher quality and more consistent substrate processing.
- Reduced energy consumption and waste.
- Extended lifespan of process chamber equipment.
Commercial Applications
Substrate Processing Equipment for Semiconductor Industry
This technology can be integrated into substrate processing equipment used in semiconductor fabrication facilities, improving overall efficiency and product quality.
Prior Art
Readers interested in prior art related to this technology can explore patents and research papers on substrate supports, RF electrodes, and impedance matching in process chambers.
Frequently Updated Research
Researchers are continually exploring ways to optimize substrate processing in various industries, including semiconductor manufacturing and advanced materials development.
Questions about Substrate Supports for Process Chambers
What are the key components of a substrate support for a process chamber?
A substrate support typically includes a pedestal, heating elements, an RF electrode, a hollow shaft, and an RF rod with low impedance.
How does the low impedance of the RF rod impact the performance of the RF electrode?
The low impedance of the RF rod allows for more efficient energy transfer to the substrate, improving process chamber performance and substrate processing outcomes.
Original Abstract Submitted
Embodiments of substrate supports for process chambers are provided herein. In some embodiments, a substrate support for a process chamber includes: a pedestal having a support surface for supporting a substrate, one or more heating elements disposed therein, and a radio frequency (RF) electrode disposed therein; a hollow shaft coupled to a lower surface of the pedestal; and an RF rod extending through the hollow shaft and coupled to the RF electrode, wherein an impedance of the RF rod is less than about 0.2 ohms.
