18072456. SEMICONDUCTOR PACKAGES WITH SIDE-FACING AMBIENT LIGHT SENSORS simplified abstract (TEXAS INSTRUMENTS INCORPORATED)

SEMICONDUCTOR PACKAGES WITH SIDE-FACING AMBIENT LIGHT SENSORS

Organization Name

TEXAS INSTRUMENTS INCORPORATED

Inventor(s)

Masamitsu Matsuura of Beppu-Shi (JP)

SEMICONDUCTOR PACKAGES WITH SIDE-FACING AMBIENT LIGHT SENSORS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18072456 titled 'SEMICONDUCTOR PACKAGES WITH SIDE-FACING AMBIENT LIGHT SENSORS

Simplified Explanation

The semiconductor package described in the abstract includes a semiconductor die with an ambient light sensor, first and second conductive terminals wirebonded to the die, and a clear mold compound covering the die and portions of the terminals. The first segments of the terminals extend vertically through the mold compound to the exterior, while the second segments are positioned outside the mold compound, extending horizontally in opposing directions for connection to a printed circuit board.

• Semiconductor package with ambient light sensor
• First and second conductive terminals wirebonded to semiconductor die
• Clear mold compound covering die and terminals
• Vertical extension of first segments through mold compound
• Horizontal extension of second segments outside mold compound for connection to printed circuit board

Potential Applications

The technology described in the patent application could be used in various applications such as:

• Ambient light sensing in electronic devices
• Automatic brightness adjustment in displays
• Light-sensitive control systems in smart homes

Problems Solved

This technology helps in solving the following problems:

• Accurate ambient light sensing in electronic devices
• Efficient automatic brightness adjustment in displays
• Enhanced light-sensitive control systems in smart homes

Benefits

The benefits of this technology include:

• Improved accuracy in ambient light sensing
• Energy efficiency through automatic brightness adjustment
• Enhanced functionality in light-sensitive control systems

Potential Commercial Applications

The semiconductor package with an ambient light sensor could find commercial applications in:

• Consumer electronics
• Automotive industry
• Smart home devices

Possible Prior Art

One possible prior art for this technology could be the integration of ambient light sensors in electronic devices for automatic brightness adjustment.

How does the technology impact the overall cost of the semiconductor package?

The abstract does not provide information on the cost implications of implementing this technology. It would be important to understand if the additional features increase the overall cost of the package or if they can be integrated cost-effectively.

Are there any limitations to the horizontal extension of the second segments of the conductive terminals?

The abstract does not mention any limitations or challenges related to the horizontal extension of the second segments of the conductive terminals. It would be essential to explore if there are any constraints or potential issues with this design aspect.

Original Abstract Submitted

In examples, a semiconductor package comprises a semiconductor die including an ambient light sensor, the ambient light sensor facing a horizontal direction. The package includes first and second conductive terminals wirebonded to the semiconductor die, each of the first and second conductive terminals having first and second segments. The package includes a clear mold compound covering the semiconductor die and portions of the first and second conductive terminals. The first segments of the first and second conductive terminals extend vertically through the clear mold compound to an exterior of the clear mold compound, and wherein the second segments of the first and second conductive terminals are positioned exterior to the clear mold compound, extend horizontally in opposing directions, and are adapted to be coupled to a printed circuit board.