18072426. SEMICONDUCTOR PACKAGE CONDUCTIVE TERMINALS WITH REDUCED PLATING THICKNESS simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
Contents
- 1 SEMICONDUCTOR PACKAGE CONDUCTIVE TERMINALS WITH REDUCED PLATING THICKNESS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE CONDUCTIVE TERMINALS WITH REDUCED PLATING THICKNESS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR PACKAGE CONDUCTIVE TERMINALS WITH REDUCED PLATING THICKNESS
Organization Name
TEXAS INSTRUMENTS INCORPORATED
Inventor(s)
Rafael Jose Lizares Guevara of Angeles (PH)
Jose Arvin M. Plomantes of Dagupan (PH)
SEMICONDUCTOR PACKAGE CONDUCTIVE TERMINALS WITH REDUCED PLATING THICKNESS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18072426 titled 'SEMICONDUCTOR PACKAGE CONDUCTIVE TERMINALS WITH REDUCED PLATING THICKNESS
Simplified Explanation
The abstract describes a method for manufacturing a semiconductor package involving the formation of copper, photoresist, nickel, and palladium members in specific volumes and diameters.
- Formation of copper member on a surface
- Application of photoresist to the copper member and surface
- Formation of a cavity in the photoresist above the copper member with two different volumes and diameters
- Formation of a nickel member in the larger volume closer to the copper member
- Formation of a palladium member in the smaller volume
Potential Applications
The technology described in this patent application could be applied in the manufacturing of semiconductor packages for various electronic devices such as smartphones, computers, and other consumer electronics.
Problems Solved
This technology solves the problem of efficiently creating semiconductor packages with precise configurations and materials, which is crucial for the performance and reliability of electronic devices.
Benefits
The benefits of this technology include improved manufacturing processes, enhanced performance of semiconductor packages, and potentially lower costs due to optimized material usage.
Potential Commercial Applications
- "Innovative Semiconductor Package Manufacturing Method for Enhanced Performance and Reliability"
Possible Prior Art
There may be prior art related to semiconductor packaging methods involving the use of different materials and configurations, but specific examples are not provided in this context.
Unanswered Questions
How does this method compare to traditional semiconductor packaging techniques?
This article does not provide a direct comparison between this method and traditional semiconductor packaging techniques. Further research or analysis would be needed to determine the specific differences and advantages.
What specific electronic devices could benefit the most from this semiconductor packaging technology?
The article does not specify which electronic devices could benefit the most from this semiconductor packaging technology. A study or market analysis focusing on different electronic devices and their requirements would be necessary to answer this question accurately.
Original Abstract Submitted
In some examples, a method for manufacturing a semiconductor package comprises forming a copper member on a surface; applying a photoresist to the copper member and the surface; and forming a cavity in the photoresist above the copper member. The cavity has a first volume with a first diameter and a second volume with a second diameter larger than the first diameter. The second volume is more proximal to the copper member than the first volume. The method also includes forming a nickel member in the second volume forming a palladium member in the first volume.
