18072171. SUBSTRATE DEFECT ANALYSIS simplified abstract (Applied Materials, Inc.)
Contents
- 1 SUBSTRATE DEFECT ANALYSIS
SUBSTRATE DEFECT ANALYSIS
Organization Name
Inventor(s)
Seng Keong Lim of Fremont CA (US)
SUBSTRATE DEFECT ANALYSIS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18072171 titled 'SUBSTRATE DEFECT ANALYSIS
Simplified Explanation
The method described in the abstract involves identifying property data of a substrate processed by a substrate processing system, categorizing regions of the substrate based on defect categories, sub-categorizing these regions into defect sub-categories, and performing corrective actions based on the identified defects.
- Identification of property data of a substrate processed by a substrate processing system
- Categorization of regions of the substrate into defect categories
- Sub-categorization of regions into defect sub-categories
- Performance of corrective actions based on identified defects
Potential Applications
This technology could be applied in the semiconductor industry for quality control and defect management in substrate processing systems.
Problems Solved
This technology helps in identifying and categorizing defects in substrates, allowing for targeted corrective actions to be taken, ultimately improving the quality of processed substrates.
Benefits
- Improved quality control in substrate processing systems - Efficient defect management leading to reduced wastage - Enhanced overall performance of the substrate processing system
Potential Commercial Applications
Optimizing defect management in semiconductor manufacturing processes
Possible Prior Art
One possible prior art could be the use of automated defect detection systems in semiconductor manufacturing processes to improve quality control and efficiency.
What are the limitations of this technology in real-world applications?
One limitation of this technology could be the complexity of analyzing and categorizing various types of defects accurately in real-time.
How does this technology compare to existing defect management systems in terms of accuracy and efficiency?
This technology offers the advantage of sub-categorizing defects for more targeted corrective actions, potentially leading to improved accuracy and efficiency compared to traditional defect management systems.
Original Abstract Submitted
A method includes identifying property data of a substrate processed by a substrate processing system. The method further includes identifying, based on a first subset of the property data, a plurality of regions of the substrate corresponding to a first defect category. The method further includes sub-categorizing, based on a second subset of the property data, the plurality of regions of the substrate corresponding to the first defect category into a plurality of defect sub-categories. The method further includes causing, based on one or more of the plurality of regions corresponding to at least one of the plurality of defect sub-categories, performance of a corrective action associated with the substrate processing system.
