18072096. SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR DEVICES simplified abstract (Tokyo Electron Limited)
Contents
- 1 SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR DEVICES
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR DEVICES - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR DEVICES
Organization Name
Inventor(s)
Sitaram Arkalgud of Tokyo (JP)
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR DEVICES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18072096 titled 'SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR DEVICES
Simplified Explanation
The method described in the abstract involves manufacturing semiconductor packages by attaching a semiconductor die to wafers, forming connectors, and bonding the die to another wafer with a second semiconductor die.
- The method involves overlaying metallization layers with barrier, stop, and laser liftoff layers to protect the die during manufacturing.
- The die is attached to wafers using the laser liftoff layer, allowing for easy removal of the wafer later in the process.
- Connectors are formed on the die to electrically couple to the metallization layers.
- The die is bonded to another wafer containing a second semiconductor die, creating a complete semiconductor package.
Potential Applications
The technology described in this patent application could be used in the manufacturing of various semiconductor devices, such as microprocessors, memory chips, and sensors.
Problems Solved
This method solves the problem of efficiently manufacturing semiconductor packages with multiple dies and complex metallization layers. The use of the laser liftoff layer allows for easy detachment of the wafer, reducing the risk of damage to the die during manufacturing.
Benefits
Some benefits of this technology include improved manufacturing efficiency, reduced risk of damage to the semiconductor die, and the ability to create complex semiconductor packages with multiple dies.
Potential Commercial Applications
This technology could be applied in the production of advanced electronic devices, such as smartphones, tablets, and computers, where compact and high-performance semiconductor packages are required.
Possible Prior Art
One possible prior art for this technology could be the use of laser liftoff layers in semiconductor manufacturing processes to facilitate the detachment of wafers from semiconductor dies.
Unanswered Questions
How does the method ensure the alignment of the semiconductor die with the wafers during attachment?
The abstract does not provide details on how the alignment of the semiconductor die with the wafers is achieved, which could be crucial for the success of the manufacturing process.
What materials are used for the barrier, stop, and laser liftoff layers, and how do they contribute to the protection of the semiconductor die?
The abstract mentions the overlaying of the metallization layers with barrier, stop, and laser liftoff layers, but does not specify the materials used or how they help protect the semiconductor die. Understanding the properties of these layers could provide insights into the effectiveness of the manufacturing method.
Original Abstract Submitted
A method for manufacturing semiconductor packages. The method includes providing a first semiconductor die including a plurality of metallization layers; completely overlaying a topmost one of the metallization layers with a barrier layer; completely overlaying the barrier layer sequentially with a stop layer and a laser liftoff layer; attaching a first side of the first semiconductor die to a first wafer through at least the laser liftoff layer; attaching a second side of the first semiconductor die to a second wafer; removing the first wafer from the first semiconductor die based on the laser liftoff layer; forming a plurality of connectors on the first side of the first semiconductor die to electrically couple to the topmost metallization layer; and bonding the first semiconductor die to a third wafer that includes a second semiconductor die.
