18072026. Slot Bow-Tie Antenna On Package simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
Contents
- 1 Slot Bow-Tie Antenna On Package
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 Slot Bow-Tie Antenna On Package - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 How does this technology impact power consumption in devices?
- 1.11 What are the potential challenges in manufacturing semiconductor packages with this technology?
- 1.12 Original Abstract Submitted
Slot Bow-Tie Antenna On Package
Organization Name
TEXAS INSTRUMENTS INCORPORATED
Inventor(s)
Rajen M. Murugan of Dallas TX (US)
Aditya Nitin Jogalekar of Dallas TX (US)
Slot Bow-Tie Antenna On Package - A simplified explanation of the abstract
This abstract first appeared for US patent application 18072026 titled 'Slot Bow-Tie Antenna On Package
Simplified Explanation
The semiconductor package described in the abstract includes a semiconductor die with a passivation layer, a first metal layer with an antenna and transmission line, and a second metal layer functioning as a ground reflector.
- Semiconductor die with passivation layer
- First metal layer with antenna and transmission line
- Antenna with slot bow-tie configuration
- Insulating material separating first and second metal layers
- Second metal layer functioning as ground reflector
Potential Applications
This technology could be applied in:
- Wireless communication devices
- RFID tags
- Sensor systems
Problems Solved
This technology helps in:
- Improving signal transmission and reception
- Enhancing antenna performance
- Reducing interference
Benefits
The benefits of this technology include:
- Increased efficiency in wireless communication
- Enhanced signal quality
- Compact design for smaller devices
Potential Commercial Applications
This technology could be commercially benefit:
- Telecommunications industry
- IoT devices market
- Aerospace and defense sector
Possible Prior Art
One possible prior art for this technology could be:
- Antenna integration in semiconductor packages
- Ground reflectors in semiconductor devices
Unanswered Questions
How does this technology impact power consumption in devices?
This technology could potentially impact power consumption by improving signal strength and reducing interference, leading to more efficient use of power resources.
What are the potential challenges in manufacturing semiconductor packages with this technology?
Some potential challenges in manufacturing could include ensuring precise alignment of the antenna and transmission line, as well as maintaining the integrity of the insulating material between metal layers.
Original Abstract Submitted
An example semiconductor package comprises a semiconductor die having a top surface, a passivation layer over the top surface, a first metal layer on the first passivation layer, an antenna formed in the first metal layer and offset from the semiconductor die, the antenna having a slot bow-tie configuration, a transmission line formed in the first metal layer, the transmission line coupling the semiconductor die to the antenna, and an insulating material separating the first metal layer from a second metal layer, the second metal layer configured to function as a ground reflector for the antenna. The second metal layer may extend below the antenna and the semiconductor die.
