18071961. PERMANENT LAYER FOR BUMP CHIP ATTACH simplified abstract (Intel Corporation)
Contents
- 1 PERMANENT LAYER FOR BUMP CHIP ATTACH
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PERMANENT LAYER FOR BUMP CHIP ATTACH - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
PERMANENT LAYER FOR BUMP CHIP ATTACH
Organization Name
Inventor(s)
Frederick Atadana of Hillsboro OR (US)
Jean Bosco Kana Kana of Chandler AZ (US)
Shripad Gokhale of Gilbert AZ (US)
Xavier F. Brun of Chandler AZ (US)
PERMANENT LAYER FOR BUMP CHIP ATTACH - A simplified explanation of the abstract
This abstract first appeared for US patent application 18071961 titled 'PERMANENT LAYER FOR BUMP CHIP ATTACH
Simplified Explanation
The patent application describes microelectronics package architectures utilizing glass layers and methods of manufacturing the same. The packages include a silicon layer, dies, and a glass layer, with the silicon layer containing vias, the dies in electrical communication with the vias, and the glass layer containing interconnects in electrical communication with the vias.
- Silicon layer with vias
- Dies in electrical communication with vias
- Glass layer with interconnects in electrical communication with vias
Potential Applications
The technology described in the patent application could be applied in various industries such as semiconductor manufacturing, electronics, telecommunications, and consumer electronics.
Problems Solved
This technology solves the problem of improving the performance and reliability of microelectronics packages by utilizing glass layers for interconnects, which can provide better electrical communication and thermal management.
Benefits
The benefits of this technology include enhanced electrical performance, improved thermal management, increased reliability, and potentially reduced manufacturing costs.
Potential Commercial Applications
One potential commercial application of this technology could be in the production of advanced microelectronics packages for high-performance computing, mobile devices, Internet of Things (IoT) devices, and automotive electronics.
Possible Prior Art
One possible prior art for this technology could be the use of traditional materials such as organic substrates or ceramic layers in microelectronics packaging. Glass layers may not have been widely explored in this context before.
Unanswered Questions
How does this technology compare to existing microelectronics packaging solutions on the market?
This article does not provide a direct comparison between this technology and existing microelectronics packaging solutions. Further research or a comparative analysis would be needed to answer this question.
What are the potential challenges or limitations of implementing this technology in mass production?
The article does not address the potential challenges or limitations of implementing this technology in mass production. Factors such as scalability, cost-effectiveness, and compatibility with existing manufacturing processes could be important considerations.
Original Abstract Submitted
Disclosed herein are microelectronics package architectures utilizing glass layers and methods of manufacturing the same. The microelectronics packages may include a silicon layer, dies, and a glass layer. The silicon layer may include vias. The dies may be in electrical communication with vias. The glass layer may include interconnects in electrical communication with the vias.
