18071797. PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)
Contents
- 1 PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
Organization Name
Inventor(s)
WU-DER Yang of TAOYUAN CITY (TW)
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18071797 titled 'PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
Simplified Explanation
The package structure described in the patent application involves the arrangement of electronic components on substrates with patterned circuit layers, allowing for electrical connections through extending portions beyond the sidewalls of through holes.
- First substrate with a first electronic component connected to a patterned circuit layer through an extending portion beyond a through hole sidewall
- Second substrate with a second electronic component connected to a patterned circuit layer through an inner extending portion beyond a through hole sidewall
Potential Applications
The technology described in this patent application could be applied in the manufacturing of electronic devices such as smartphones, tablets, and laptops where compact and efficient packaging of electronic components is crucial.
Problems Solved
This technology solves the problem of efficiently connecting electronic components on substrates with through holes, allowing for a more compact and reliable package structure.
Benefits
The benefits of this technology include improved electrical connections, reduced space requirements, and enhanced overall performance of electronic devices.
Potential Commercial Applications
- "Innovative Package Structure for Electronic Devices: Enhancing Performance and Reliability"
Possible Prior Art
There may be prior art related to package structures for electronic components, but specific examples are not provided in this patent application.
Unanswered Questions
How does this package structure compare to existing methods in terms of cost-effectiveness?
The patent application does not provide information on the cost-effectiveness of this package structure compared to existing methods.
Are there any limitations to the size or type of electronic components that can be used with this package structure?
The patent application does not address any limitations regarding the size or type of electronic components that can be used with this package structure.
Original Abstract Submitted
A package structure and a method of manufacturing a package structure are provided. The package structure includes a first substrate, a first electronic component, a second substrate and a second electronic component. The first electronic component is disposed over a first through hole of the first substrate. The first electronic component is electrically connected to a first patterned circuit layer of the first substrate through an extending portion of the first patterned circuit layer extending beyond a sidewall of the first through hole. The second electronic component is disposed over a second through hole of the second substrate. The second electronic component is electrically connected to a second patterned circuit layer of the second substrate through an inner extending portion of the second patterned circuit layer extending beyond a sidewall of the second through hole.
