18071257. SHAPE MEMORY POLYMER (SMP) GLASS CORE PACKAGE FOR MODULATING WARPAGE simplified abstract (Intel Corporation)
Contents
- 1 SHAPE MEMORY POLYMER (SMP) GLASS CORE PACKAGE FOR MODULATING WARPAGE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SHAPE MEMORY POLYMER (SMP) GLASS CORE PACKAGE FOR MODULATING WARPAGE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SHAPE MEMORY POLYMER (SMP) GLASS CORE PACKAGE FOR MODULATING WARPAGE
Organization Name
Inventor(s)
Vinith Bejugam of Chandler AZ (US)
Whitney Bryks of Tempe AZ (US)
Brandon C. Marin of Gilbert AZ (US)
Vishal Bhimrao Zade of Chandler AZ (US)
Deniz Turan of Chandler AZ (US)
Srinivas V. Pietambaram of Chandler AZ (US)
SHAPE MEMORY POLYMER (SMP) GLASS CORE PACKAGE FOR MODULATING WARPAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18071257 titled 'SHAPE MEMORY POLYMER (SMP) GLASS CORE PACKAGE FOR MODULATING WARPAGE
Simplified Explanation
The patent application abstract describes package substrates with a glass core and shape memory polymer (SMP) layers.
- Glass core package substrate
- Buildup layers over the core
- Shape memory polymer (SMP) layer over the core
Potential Applications
The technology could be applied in various industries such as electronics, medical devices, and aerospace for packaging sensitive components.
Problems Solved
The technology solves the problem of protecting delicate components from damage during transportation or use by providing a strong and resilient package substrate.
Benefits
The benefits of this technology include improved protection for sensitive components, increased durability, and potential cost savings due to reduced damage.
Potential Commercial Applications
"Enhanced Package Substrates for Electronics and Medical Devices"
Possible Prior Art
No prior art information is available at this time.
Unanswered Questions
How does the SMP layer enhance the performance of the package substrate?
The SMP layer provides flexibility and resilience to the package substrate, allowing it to adapt to different conditions and protect the core effectively.
Are there any limitations to the use of glass cores in package substrates?
Glass cores may have limitations in terms of weight and fragility, which could impact the overall durability and reliability of the package substrate.
Original Abstract Submitted
Embodiments disclosed herein include package substrates. In a particular embodiment, the package substrate comprises a core. The core may be a glass core. In an embodiment, buildup layers are provided over the core, and a shape memory polymer (SMP) is provided over the core.
