18071237. GLASS EMBEDDED TRUE AIR CORE INDUCTORS simplified abstract (Intel Corporation)
Contents
- 1 GLASS EMBEDDED TRUE AIR CORE INDUCTORS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 GLASS EMBEDDED TRUE AIR CORE INDUCTORS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 How does the conductive structure improve the performance of the package core?
- 1.11 What materials are typically used for the core substrate in such package cores?
- 1.12 Original Abstract Submitted
GLASS EMBEDDED TRUE AIR CORE INDUCTORS
Organization Name
Inventor(s)
Suddhasattwa Nad of Chandler AZ (US)
Brandon C. Marin of Gilbert AZ (US)
Jeremy D. Ecton of Gilbert AZ (US)
Srinivas V. Pietambaram of Chandler AZ (US)
Mohammad Mamunur Rahman of Gilbert AZ (US)
GLASS EMBEDDED TRUE AIR CORE INDUCTORS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18071237 titled 'GLASS EMBEDDED TRUE AIR CORE INDUCTORS
Simplified Explanation
The patent application abstract describes a package core with specific features such as core substrate, openings, and conductive structures.
- The package core includes a core substrate with a first opening and a second opening.
- There is a first conductive structure around the core substrate between the first and second openings.
- Additionally, there may be a second conductive structure around the core substrate outside of the openings.
Potential Applications
The technology described in the patent application could be applied in various electronic packaging systems where electrical conductivity and structural integrity are important.
Problems Solved
This technology solves the problem of providing a package core with specific electrical and structural features that are necessary for certain electronic applications.
Benefits
The benefits of this technology include improved electrical connectivity, enhanced structural support, and potentially increased efficiency in electronic devices.
Potential Commercial Applications
The technology could be utilized in the manufacturing of electronic components, circuit boards, sensors, and other devices that require precise electrical connections and structural stability.
Possible Prior Art
One possible prior art could be similar package core designs used in electronic packaging systems, but without the specific features described in this patent application.
Unanswered Questions
How does the conductive structure improve the performance of the package core?
The conductive structure helps to ensure proper electrical connectivity within the package core, but the specific mechanisms of this improvement are not detailed in the abstract.
What materials are typically used for the core substrate in such package cores?
The abstract does not mention the specific materials used for the core substrate, which could be important for understanding the overall performance and characteristics of the package core.
Original Abstract Submitted
Embodiments disclosed herein include a package core. In an embodiment, the package core comprises a core substrate, a first opening through the core substrate, a second opening through the core substrate and adjacent to the first opening, and a first structure around the core substrate between the first opening and the second opening. In an embodiment, the first structure is electrically conductive. The package core may further comprise a second structure around the core substrate outside of the first opening and the second opening, where the second structure is electrically conductive.
