18071164. WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
Contents
- 1 WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE
Organization Name
TEXAS INSTRUMENTS INCORPORATED
Inventor(s)
Masamitsu Matsuura of Beppu (JP)
WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18071164 titled 'WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE
Simplified Explanation
The apparatus described in the patent application includes a metal leadframe with a dielectric die support, a semiconductor die mounted on the dielectric die support, electrical connections from the semiconductor die to the metal leads of the leadframe, and a mold compound covering the components to form a package body.
- Metal leadframe with dielectric die support and metal leads
- Die attach material over the dielectric die support
- Semiconductor die mounted on the dielectric die support with bond pads
- Electrical connections from bond pads to metal leads
- Mold compound covering the components to form a package body
Potential Applications
The technology described in the patent application could be used in the manufacturing of semiconductor devices, such as integrated circuits, sensors, and microcontrollers.
Problems Solved
This technology solves the problem of providing a reliable and efficient way to package semiconductor dies onto leadframes, ensuring proper electrical connections and protection for the components.
Benefits
The benefits of this technology include improved reliability, increased efficiency in manufacturing processes, and enhanced protection for semiconductor dies.
Potential Commercial Applications
- Semiconductor industry: for the production of various semiconductor devices
- Electronics manufacturing: for the assembly of electronic components in consumer electronics, automotive, and industrial applications
Possible Prior Art
One possible prior art for this technology could be the use of wire bonding and encapsulation techniques in semiconductor packaging processes.
What materials are used in the die attach material?
The die attach material typically consists of conductive adhesives or solder pastes that provide a strong bond between the semiconductor die and the dielectric die support.
How does the mold compound protect the components in the package body?
The mold compound encapsulates the semiconductor die, electrical connections, and other components, providing physical protection against environmental factors such as moisture, dust, and mechanical stress.
Original Abstract Submitted
In a described example, an apparatus includes: a metal leadframe including a dielectric die support formed in a central portion of the leadframe, and having metal leads extending from the central portion, portions of the metal leads extending into the central portion contacted by the dielectric die support; die attach material over the dielectric die support; a semiconductor die mounted to the dielectric die support by the die attach material, the semiconductor die having bond pads on a device side surface facing away from the dielectric die support; electrical connections extending from the bond pads to metal leads of the leadframe; and mold compound covering the semiconductor die, the electrical connections, the dielectric die support, and portions of the metal leads, the mold compound forming a package body.
