18071116. RBTV IMPROVEMENT FOR GLASS CORE ARCHITECTURES simplified abstract (Intel Corporation)
Contents
- 1 RBTV IMPROVEMENT FOR GLASS CORE ARCHITECTURES
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 RBTV IMPROVEMENT FOR GLASS CORE ARCHITECTURES - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
RBTV IMPROVEMENT FOR GLASS CORE ARCHITECTURES
Organization Name
Inventor(s)
Mohammad Mamunur Rahman of Gilbert AZ (US)
Jeremy D. Ecton of Gilbert AZ (US)
RBTV IMPROVEMENT FOR GLASS CORE ARCHITECTURES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18071116 titled 'RBTV IMPROVEMENT FOR GLASS CORE ARCHITECTURES
Simplified Explanation
The patent application abstract describes an interconnect with a pad over a substrate, including a hole exposing a portion of the substrate, with solder bridging across the hole through the pad.
- The interconnect includes a substrate and a pad over the substrate.
- A hole is provided through the pad, exposing a portion of the substrate.
- Solder is applied over the pad, bridging across the hole through the pad.
Potential Applications
This technology could be applied in electronic devices, circuit boards, and semiconductor manufacturing.
Problems Solved
This innovation helps in creating reliable and efficient connections between components in electronic devices.
Benefits
The interconnect design allows for improved signal transmission, reduced signal loss, and enhanced overall performance of electronic devices.
Potential Commercial Applications
The technology could be utilized in the production of smartphones, computers, tablets, and other consumer electronics.
Possible Prior Art
One possible prior art could be traditional methods of interconnect design in electronic devices, which may not provide the same level of efficiency and reliability as the disclosed innovation.
Unanswered Questions
How does this interconnect design compare to existing methods in terms of cost-effectiveness?
The article does not provide information on the cost implications of implementing this technology compared to traditional interconnect designs.
Are there any limitations to the size or scale at which this interconnect can be implemented?
The article does not address whether there are any restrictions on the size or scale of devices where this interconnect design can be effectively utilized.
Original Abstract Submitted
Embodiments disclosed herein include an interconnect. In an embodiment, the interconnect comprises a substrate and a pad over the substrate. In an embodiment, a hole is provided through the pad. In an embodiment, the hole exposes a portion of the substrate. In an embodiment, a solder is provided over the pad, and the solder bridges across the hole through the pad.
