18070602. ELECTRONIC MODULE AND ELECTRONIC DEVICE simplified abstract (CANON KABUSHIKI KAISHA)

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ELECTRONIC MODULE AND ELECTRONIC DEVICE

Organization Name

CANON KABUSHIKI KAISHA

Inventor(s)

Nobuaki Yamashita of Kanagawa (JP)

Takashi Numagi of Tokyo (JP)

Kunihiko Uchida of Saitama (JP)

ELECTRONIC MODULE AND ELECTRONIC DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18070602 titled 'ELECTRONIC MODULE AND ELECTRONIC DEVICE

Simplified Explanation

The abstract describes an electronic module that includes a wiring board with two main surfaces and two semiconductor elements mounted on it. The wiring board has signal lines and ground traces in different conductor layers.

  • The electronic module includes a wiring board with two main surfaces.
  • Two semiconductor elements are mounted on the wiring board.
  • The first semiconductor element has two signal terminals.
  • The second semiconductor element has two signal terminals.
  • The wiring board has a first signal line with a signal trace in a first conductor layer.
  • The wiring board has a second signal line with a signal trace in a second conductor layer closer to the second main surface.
  • The wiring board also has ground traces in both conductor layers.

Potential applications of this technology:

  • Electronic devices and systems that require multiple semiconductor elements.
  • Circuit boards with efficient signal and ground connections.

Problems solved by this technology:

  • Efficient signal routing and grounding in electronic modules.
  • Integration of multiple semiconductor elements on a single wiring board.

Benefits of this technology:

  • Improved performance and reliability of electronic modules.
  • Simplified design and manufacturing process for electronic devices.


Original Abstract Submitted

An electronic module includes a wiring board having a first main surface and a second main surface on a back side of the first main surface, and a first semiconductor element and a second semiconductor element that are mounted on the wiring board. The first semiconductor element includes a first signal terminal and a second signal terminal. The second semiconductor element includes a third signal terminal and a fourth signal terminal. The wiring board includes a first signal line including a first signal trace disposed in a first conductor layer, a second signal line including a second signal trace disposed in a second conductor layer that is closer to the second main surface than the first conductor layer is, a first ground trace disposed in the first conductor layer, and a second ground trace disposed in the second conductor layer.

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