18070530. LEADFRAME BASED POWER MODULE simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
Contents
- 1 LEADFRAME BASED POWER MODULE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 LEADFRAME BASED POWER MODULE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
LEADFRAME BASED POWER MODULE
Organization Name
TEXAS INSTRUMENTS INCORPORATED
Inventor(s)
MASAMITSU Matsuura of Beppu (JP)
LEADFRAME BASED POWER MODULE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18070530 titled 'LEADFRAME BASED POWER MODULE
Simplified Explanation
The patent application describes an electronic device with a leadframe, pins, a die, a mold compound, and an electronic component. The pins have proximate and distal ends, with at least two pins having distal ends perpendicular in one direction and the remaining pins perpendicular in the opposite direction.
- Leadframe with pins having proximate and distal ends
- Die attached to proximate end of pins
- Mold compound encapsulates the die
- Electronic component attached to leadframe
- Distal ends of pins perpendicular in different directions
Potential Applications
The technology described in the patent application could be used in various electronic devices such as sensors, actuators, and communication devices.
Problems Solved
This technology provides a more efficient and reliable way to assemble electronic devices by ensuring proper alignment and connection of components.
Benefits
- Improved alignment of components
- Enhanced reliability of electronic devices
- Simplified manufacturing process
Potential Commercial Applications
"Advanced Electronic Device Assembly Techniques for Improved Performance"
Possible Prior Art
There may be existing patents or publications related to leadframe assembly techniques in the field of electronics manufacturing.
Unanswered Questions
How does this technology compare to existing leadframe assembly methods?
The article does not provide a direct comparison with other leadframe assembly methods, leaving the reader to wonder about the specific advantages of this new approach.
What are the specific electronic devices that could benefit the most from this technology?
The article mentions various electronic devices as potential applications, but it does not delve into the specific types of devices that could see the greatest improvement from this innovation.
Original Abstract Submitted
An electronic device includes a leadframe that includes pins, where the pins have a proximate end and a distal end. A die is attached to the proximate end of the pins of the leadframe and a mold compound encapsulates the die. An electronic component is attached to the leadframe. The distal end of at least two of the pins are substantially perpendicular to the proximate end of the pins in a first direction and the distal end of the remaining pins are substantially perpendicular to the proximate end of the pins in a second direction that is opposite that of the first direction.
