18070523. OPEN CAVITY INTEGRATED CIRCUIT simplified abstract (TEXAS INSTRUMENTS INCORPORATED)

OPEN CAVITY INTEGRATED CIRCUIT

Organization Name

TEXAS INSTRUMENTS INCORPORATED

Inventor(s)

STEVEN ALFRED Kummerl of Carrollton TX (US)

SREENIVASAN K. Koduri of Dallas TX (US)

SOPHIA Delpak of Richardson TX (US)

LAURA MAY ANTIONETTE Clemente of MABALACAT CITY (PH)

OPEN CAVITY INTEGRATED CIRCUIT - A simplified explanation of the abstract

This abstract first appeared for US patent application 18070523 titled 'OPEN CAVITY INTEGRATED CIRCUIT

Simplified Explanation

The electronic device described in the patent application includes a die with a sensor in communication with the active surface of the die, surrounded by a ring with a cylindrical wall and a cap extending beyond the wall. A mold compound covers the die and forms a cavity to expose the sensor to the external environment.

• The electronic device includes a die with an active surface and a sensor in communication with it.
• A ring encircles the sensor, with a cylindrical wall and a cap extending beyond the wall.
• A mold compound covers the die and forms a cavity to expose the sensor to the external environment.

Potential Applications

This technology could be used in various electronic devices such as smartphones, wearables, and IoT devices to enhance sensor functionality and environmental exposure.

Problems Solved

This technology solves the problem of protecting the sensor while ensuring it is exposed to the external environment for accurate readings and data collection.

Benefits

The benefits of this technology include improved sensor performance, increased durability, and enhanced environmental sensing capabilities.

Potential Commercial Applications

The potential commercial applications of this technology could be in the fields of consumer electronics, healthcare devices, and industrial sensors for monitoring and data collection.

Possible Prior Art

One possible prior art could be similar sensor packaging designs used in electronic devices to protect and expose sensors to the external environment.

How does this technology impact the overall size of the electronic device?

This article does not address how the addition of the ring and cavity for the sensor affects the size and form factor of the electronic device.

What materials are used in the construction of the ring and cap for environmental exposure?

The article does not specify the materials used in the construction of the ring and cap to ensure sensor exposure to the external environment.

Original Abstract Submitted

An electronic device includes a substrate and a die having an active surface disposed on the substrate. A sensor is in communication with the active surface of the die. A ring encircles the sensor and includes a cylindrical wall and a cap, where the cap has a partial circular shape that extends beyond each side of the wall. A mold compound covers the die and abuts an outer surface of the wall thereby forming a cavity in the mold compound to expose the sensor to an environment external to the electronic device.