18069044. PACKAGE BUMPS OF A PACKAGE SUBSTRATE simplified abstract (QUALCOMM Incorporated)
Contents
PACKAGE BUMPS OF A PACKAGE SUBSTRATE
Organization Name
Inventor(s)
PACKAGE BUMPS OF A PACKAGE SUBSTRATE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18069044 titled 'PACKAGE BUMPS OF A PACKAGE SUBSTRATE
The abstract describes techniques for integrated circuits (ICs) in which an IC package includes a package substrate with a metallization structure, an IC die attached to the upper surface of the package substrate, first package bumps and second package bumps on the lower surface of the package substrate arranged in a diagonal direction.
- Simplified Explanation:
The patent application discusses a method for creating integrated circuits with specific package bumps on a package substrate.
- Key Features and Innovation:
- IC package with package substrate and metallization structure - IC die attached to the upper surface of the package substrate - First and second package bumps on the lower surface arranged in a diagonal direction
- Potential Applications:
- Semiconductor industry for manufacturing integrated circuits - Electronics manufacturing for improved circuit packaging
- Problems Solved:
- Enhanced connectivity and performance of integrated circuits - Improved reliability and durability of IC packages
- Benefits:
- Increased efficiency in circuit design and manufacturing - Enhanced functionality and performance of electronic devices
- Commercial Applications:
- Semiconductor companies for IC production - Electronics manufacturers for improved product performance
- Questions about Integrated Circuits:
1. How do the specific arrangement of package bumps on the package substrate impact the performance of integrated circuits? 2. What are the potential challenges in implementing this technique in large-scale IC production?
- Frequently Updated Research:
- Stay updated on advancements in IC packaging technology - Monitor developments in semiconductor industry for potential improvements in integrated circuit design and manufacturing.
Original Abstract Submitted
Disclosed are techniques for integrated circuits (ICs). In an aspect, an IC package includes a package substrate having an upper surface, a lower surface, a first side, and a second side perpendicular to the first side. The package substrate includes a metallization structure. The IC package further includes an IC die attached to the upper surface of the package substrate; first package bumps on the lower surface of the package substrate; and second package bumps on the lower surface of the package substrate. The first package bumps are arranged adjacent to one another along a diagonal direction that is diagonal to the package substrate, and the second package bumps are arranged adjacent to one another along the diagonal direction.
