18069004. HYBRID CIRCUIT BOARD DEVICE TO SUPPORT CIRCUIT REUSE AND METHOD OF MANUFACTURE simplified abstract (QUALCOMM Incorporated)
Contents
HYBRID CIRCUIT BOARD DEVICE TO SUPPORT CIRCUIT REUSE AND METHOD OF MANUFACTURE
Organization Name
Inventor(s)
Christopher Kong Yee Chun of Austin TX (US)
John Eaton of San Diego CA (US)
HYBRID CIRCUIT BOARD DEVICE TO SUPPORT CIRCUIT REUSE AND METHOD OF MANUFACTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18069004 titled 'HYBRID CIRCUIT BOARD DEVICE TO SUPPORT CIRCUIT REUSE AND METHOD OF MANUFACTURE
Simplified Explanation:
The patent application describes a hybrid circuit board device that combines the functionality of a parent circuit board and a child circuit board without exceeding a maximum circuit board height.
Key Features and Innovation:
- Hybrid circuit board device combining parent and child circuit boards.
- Child circuit board is disposed into a recessed portion of the parent circuit board.
- Parent circuit board has first interconnects for a first IC component, while child circuit board has second interconnects for a second IC component.
- Child circuit board is thinner than the parent circuit board in the thickness direction.
- Boards are coupled by at least one board interconnect.
Potential Applications: The technology can be used in various electronic devices where space is limited but multiple functionalities are required, such as smartphones, tablets, and wearables.
Problems Solved: The technology addresses the challenge of integrating multiple circuit boards into a compact space without exceeding height limitations.
Benefits:
- Space-saving design.
- Enhanced functionality in a limited space.
- Simplified manufacturing process.
Commercial Applications: The technology can be applied in the consumer electronics industry for the development of compact and multifunctional devices, potentially leading to cost savings and improved product performance.
Prior Art: Readers can explore prior patents related to hybrid circuit board designs, compact electronic devices, and interconnect technologies to gain a deeper understanding of the field.
Frequently Updated Research: Stay updated on advancements in hybrid circuit board technology, miniaturization techniques, and interconnect innovations to leverage the latest developments in the field.
Questions about Hybrid Circuit Board Technology: 1. What are the key advantages of integrating parent and child circuit boards in electronic devices? 2. How does the thickness of the child circuit board impact the overall design and functionality of the hybrid circuit board device?
Original Abstract Submitted
A hybrid circuit board device includes a hybrid circuit board with a second, child circuit board disposed into a recessed circuit board portion of a first, parent circuit board to combine functionality of the child circuit board and the parent circuit board without exceeding a maximum circuit board height. The parent circuit board includes a first circuit board portion having a first thickness in a thickness direction. First interconnects on the first circuit board portion can couple to a first IC component. The child circuit board includes second interconnects to couple a second IC component. The child circuit board is in the recessed circuit board portion and is coupled to the parent circuit board by at least one board interconnect. The recessed circuit board portion of the parent circuit board has a second thickness that is thinner, in the thickness direction, than the first thickness.
