18068123. SEMICONDUCTOR DEVICE WITH POWER SUPPLY DISTRIBUTION NETWORKS ON FRONTSIDE AND BACKSIDE OF A CIRCUIT simplified abstract (International Business Machines Corporation)

SEMICONDUCTOR DEVICE WITH POWER SUPPLY DISTRIBUTION NETWORKS ON FRONTSIDE AND BACKSIDE OF A CIRCUIT

Organization Name

International Business Machines Corporation

Inventor(s)

Lawrence A. Clevenger of Saratoga Springs NY (US)

Albert M. Chu of Nashua NH (US)

Nicholas Anthony Lanzillo of Wynantskill NY (US)

Brent A. Anderson of Jericho VT (US)

Reinaldo Vega of Mahopac NY (US)

SEMICONDUCTOR DEVICE WITH POWER SUPPLY DISTRIBUTION NETWORKS ON FRONTSIDE AND BACKSIDE OF A CIRCUIT - A simplified explanation of the abstract

This abstract first appeared for US patent application 18068123 titled 'SEMICONDUCTOR DEVICE WITH POWER SUPPLY DISTRIBUTION NETWORKS ON FRONTSIDE AND BACKSIDE OF A CIRCUIT

The abstract describes a semiconductor device with separate power supplies for front side and backside stacked power distribution. The device includes circuits, a first power supply, a second power supply, and a third power supply.

• The first power supply is located on one side of the circuits.
• The second power supply is also located on the same side as the first power supply.
• The third power supply is located on the opposite side of the circuits.
• The front side of the circuits is opposite to the backside of the circuits.

Potential Applications: - Semiconductor industry - Electronics manufacturing - Power distribution systems

Problems Solved: - Efficient power distribution in semiconductor devices - Improved performance and reliability of circuits

Benefits: - Enhanced power management - Increased efficiency in power distribution - Better overall performance of semiconductor devices

Commercial Applications: Title: "Innovative Semiconductor Device with Separate Power Supplies" This technology can be used in various commercial applications such as: - Consumer electronics - Automotive industry - Telecommunications sector

Questions about the technology: 1. How does the separate power supply system improve the performance of semiconductor devices? - The separate power supplies allow for more efficient power distribution, leading to enhanced performance and reliability of the circuits.

2. What are the potential challenges in implementing separate power supplies for front side and backside stacked power distribution in semiconductor devices? - Some challenges may include designing the circuits to accommodate the separate power supplies and ensuring proper insulation and heat dissipation.

Original Abstract Submitted

One or more systems, devices, and/or methods of use provided herein relate to a semiconductor device with separate power supplies for front side and backside stacked power distribution. A semiconductor device can include one or more circuits, a first power supply, a second power supply, and a third power supply. The first power supply can be disposed on a first side of the one or more circuits. The second power supply can be disposed on the first side of the one or more circuits. Further, the third power supply can be disposed on a second side of the one or more circuits. Additionally, the first side of the one or more circuits can be opposite to the second side of the one or more circuits.