18067565. THROUGH MOLDING CONTACT ENABLED EMI SHIELDING simplified abstract (QUALCOMM Incorporated)
Contents
THROUGH MOLDING CONTACT ENABLED EMI SHIELDING
Organization Name
Inventor(s)
Je-Hsiung Lan of San Diego CA (US)
Jonghae Kim of San Diego CA (US)
Ranadeep Dutta of Del Mar CA (US)
THROUGH MOLDING CONTACT ENABLED EMI SHIELDING - A simplified explanation of the abstract
This abstract first appeared for US patent application 18067565 titled 'THROUGH MOLDING CONTACT ENABLED EMI SHIELDING
The patent application describes multi-die modules with a die (e.g., a power amplifier) and an adjacent die placed side-by-side and bonded onto a substrate with a mold compound. The die may be double EMI shielded to minimize or eliminate EMI/noise coupling with the adjacent die. Another mold compound, possibly thermally conductive, may be provided to improve heat transfer away from the die and/or the adjacent die.
- Multi-die modules with side-by-side placement of dies on a substrate
- Double EMI shielding of the die to reduce EMI/noise coupling
- Use of a thermally conductive mold compound for improved heat transfer
- Potential for minimizing or eliminating EMI interference between adjacent dies
- Enhanced thermal management for better performance and reliability
Potential Applications: - Wireless communication devices - Consumer electronics - Automotive applications - Industrial equipment - Medical devices
Problems Solved: - EMI/noise interference between adjacent dies - Inadequate heat dissipation in multi-die modules - Reliability issues due to thermal stress
Benefits: - Improved performance and reliability - Enhanced EMI shielding - Efficient heat dissipation - Compact and cost-effective design
Commercial Applications: Title: Advanced Multi-Die Modules for Enhanced Performance in Electronic Devices This technology can be applied in various industries such as telecommunications, IoT devices, radar systems, and satellite communications, where EMI shielding and thermal management are critical for optimal device performance.
Prior Art: Researchers can explore prior patents related to multi-die modules, EMI shielding techniques, and thermal management solutions in electronic devices to understand the existing technology landscape.
Frequently Updated Research: Researchers and engineers are continuously exploring new materials and techniques for EMI shielding and thermal management in multi-die modules to enhance device performance and reliability.
Questions about Multi-Die Modules: 1. How does the use of double EMI shielding benefit multi-die modules? 2. What are the key challenges in implementing thermally conductive mold compounds in electronic devices?
Original Abstract Submitted
Disclosed are examples of multi-die modules that includes a die (e.g., a power amplifier) and an adjacent die placed side-by-side and bonded onto a substrate with a mold compound. The die (e.g., a switch or a low noise amplifier) may be double EMI shielded to minimize or even eliminate EMI/noise coupling with the adjacent die (e.g., switch, low noise amplifier, etc.). Another mold compound, which can be thermally conductive, may be provided to improve transfer of heat away from the die and/or the adjacent die.
