18067148. HYBRID CELL HEIGHT DESIGN WITH A BACKSIDE POWER DISTRIBUTION NETWORK simplified abstract (International Business Machines Corporation)

HYBRID CELL HEIGHT DESIGN WITH A BACKSIDE POWER DISTRIBUTION NETWORK

Organization Name

International Business Machines Corporation

Inventor(s)

Ruilong Xie of Niskayuna NY (US)

Lawrence A. Clevenger of Saratoga Springs NY (US)

Nicholas Anthony Lanzillo of Wynantskill NY (US)

Albert M. Chu of Nashua NH (US)

Reinaldo Vega of Mahopac NY (US)

Brent A. Anderson of Jericho VT (US)

HYBRID CELL HEIGHT DESIGN WITH A BACKSIDE POWER DISTRIBUTION NETWORK - A simplified explanation of the abstract

This abstract first appeared for US patent application 18067148 titled 'HYBRID CELL HEIGHT DESIGN WITH A BACKSIDE POWER DISTRIBUTION NETWORK

• • Simplified Explanation:**

The patent application describes a multi-layer integrated circuit structure with signal lines in the front-end-of-line region and power rails in the backside region of a wafer.

• • Key Features and Innovation:**
• Multi-layer integrated circuit structure
• Signal lines in the front-end-of-line region
• Power rails in the backside region
• Constant signal-line pitch
• Varying power-rail pitch

• • Potential Applications:**

This technology could be used in various electronic devices such as smartphones, computers, and other integrated circuits.

• • Problems Solved:**

This technology addresses the need for efficient power distribution and signal transmission in integrated circuits.

• • Benefits:**
• Improved performance of integrated circuits
• Enhanced power distribution efficiency
• Better signal transmission capabilities

• • Commercial Applications:**

Potential commercial applications include the semiconductor industry, electronics manufacturing, and telecommunications.

• • Prior Art:**

Readers can start searching for prior art related to this technology in the field of integrated circuit design and semiconductor manufacturing processes.

• • Frequently Updated Research:**

Stay updated on the latest advancements in integrated circuit design, semiconductor technology, and power distribution in electronic devices.

• • Questions about Multi-Layer Integrated Circuit Structure:**

1. How does the varying power-rail pitch in the backside region contribute to the efficiency of the integrated circuit structure? 2. What are the potential challenges in implementing a multi-layer integrated circuit structure with signal lines and power rails in different regions of the wafer?

Original Abstract Submitted

Embodiments of the invention provide a multi-layer integrated circuit (IC) structure that includes a back-end-of-line (BEOL) region at a first side of a wafer. A backside region is at a second side of the wafer that is opposite the first side of the wafer. A set of signal lines are in the BEOL region, and a set of power rails are in the backside region. The set of signal lines includes a substantially constant signal-line pitch between each signal line in the set of signal lines. The set of power rails includes a substantially varying power-rail pitch between each power rail in the set of power rails.