18066448. INTEGRATED BARE DIE PACKAGE, AND RELATED FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)
Contents
INTEGRATED BARE DIE PACKAGE, AND RELATED FABRICATION METHODS
Organization Name
Inventor(s)
Yeng Kwan Hoo of Unterhaching (DE)
Anna Katharina Krefft of Haar (DE)
INTEGRATED BARE DIE PACKAGE, AND RELATED FABRICATION METHODS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18066448 titled 'INTEGRATED BARE DIE PACKAGE, AND RELATED FABRICATION METHODS
Simplified Explanation: The patent application discloses integrated bare die packages and related fabrication methods. It focuses on integrating a bare die filter into the package while maintaining an acoustic cavity and conserving package size by vertically integrating the filter with a second component.
- The bare die filter is vertically integrated with a second component, such as another die or a passive electrical device, on a package substrate.
- The integration is done in a direction orthogonal to the first direction, minimizing the expansion of the package size.
- Both the bare die filter and the second component intersect a common plane in the vertical direction, preserving the acoustic cavity of the filter.
Key Features and Innovation:
- Integration of bare die filter with a second component to conserve package size.
- Vertical integration in a direction orthogonal to the first direction.
- Preservation of the acoustic cavity of the bare die filter.
- Minimization of package size expansion.
Potential Applications: The technology can be applied in various electronic devices requiring compact packaging with integrated filters, such as smartphones, IoT devices, and wearables.
Problems Solved: The technology addresses the challenge of integrating filters into bare die packages without significantly increasing the package size.
Benefits:
- Compact packaging with integrated filters.
- Efficient use of space in electronic devices.
- Improved performance of devices with integrated filters.
Commercial Applications: Potential commercial applications include the manufacturing of smartphones, IoT devices, wearables, and other electronic devices requiring integrated filters in compact packages.
Questions about Integrated Bare Die Packages: 1. How does the integration of a bare die filter with a second component help conserve package size? 2. What are the potential applications of integrated bare die packages in the electronics industry?
Original Abstract Submitted
Integrated bare die packages, and related fabrication methods are disclosed. To provide for the integration of a bare die filter into the bare die package while maintaining an acoustic cavity for the bare die filter and conserving package size, the bare die filter is vertically-integrated with a second component (e.g., another die, a second bare die filter, a passive electrical device(s)). In examples, the bare die filter is vertically-integrated with the second component in a second direction (e.g., vertical direction) orthogonal to the first direction on a first side of a package substrate of the bare die package. The bare die filter and the second component each intersect a common plane in the second direction. In this manner, the expansion in size of the bare die package through the integrated of bare die filter is minimized, while also maintaining the acoustic cavity of the bare die filter.
