18063956. STACKED AND NON-STACKED TRANSISTORS WITH DOUBLE-SIDED INTERCONNECTS simplified abstract (International Business Machines Corporation)
Contents
STACKED AND NON-STACKED TRANSISTORS WITH DOUBLE-SIDED INTERCONNECTS
Organization Name
International Business Machines Corporation
Inventor(s)
Brent A. Anderson of Jericho VT (US)
Albert M. Chu of Nashua NH (US)
Carl Radens of LaGrangeville NY (US)
Ruilong Xie of Niskayuna NY (US)
STACKED AND NON-STACKED TRANSISTORS WITH DOUBLE-SIDED INTERCONNECTS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18063956 titled 'STACKED AND NON-STACKED TRANSISTORS WITH DOUBLE-SIDED INTERCONNECTS
Simplified Explanation:
This patent application describes a semiconductor structure that includes both stacked and non-stacked transistors on the same wafer, each with frontside and backside interconnects.
Key Features and Innovation:
- Stacked transistor over another transistor
- Non-stacked transistor integrated on the same wafer
- Frontside and backside interconnects for both transistors
Potential Applications: The technology could be used in various electronic devices such as smartphones, computers, and other integrated circuits.
Problems Solved: This technology allows for more efficient use of space on a semiconductor wafer by integrating stacked and non-stacked transistors.
Benefits:
- Increased functionality in a smaller space
- Improved performance of electronic devices
- Cost-effective manufacturing process
Commercial Applications: The technology could be applied in the semiconductor industry for the production of advanced electronic devices, leading to potential market growth and innovation.
Prior Art: Readers interested in prior art related to this technology could start by researching patents in the field of semiconductor structures and integrated circuits.
Frequently Updated Research: Researchers are constantly exploring new ways to improve semiconductor structures and integrated circuits, so staying informed on the latest advancements is crucial.
Questions about Semiconductor Structures: 1. What are the main advantages of using stacked transistors in semiconductor structures? 2. How does the integration of frontside and backside interconnects benefit the performance of electronic devices?
Original Abstract Submitted
A semiconductor structure is provided that includes a stacked transistor including at least one transistor stacked over another transistor and a non-stacked transistor integrated on a same wafer. Both the stacked transistor and the non-stacked transistor include frontside and backside interconnects.
