18063011. INTEGRATED PHASED ARRAY (IPA) THERMAL SUBSYSTEM FLUID LOOP SIMULATOR simplified abstract (THE BOEING COMPANY)
Contents
INTEGRATED PHASED ARRAY (IPA) THERMAL SUBSYSTEM FLUID LOOP SIMULATOR
Organization Name
Inventor(s)
Creed Reilly of Chicago IL (US)
Gregory Kim of Chicago IL (US)
Jimmy Huynh of Chicago IL (US)
Kevin Nemeth of Chicago IL (US)
INTEGRATED PHASED ARRAY (IPA) THERMAL SUBSYSTEM FLUID LOOP SIMULATOR - A simplified explanation of the abstract
This abstract first appeared for US patent application 18063011 titled 'INTEGRATED PHASED ARRAY (IPA) THERMAL SUBSYSTEM FLUID LOOP SIMULATOR
The present application relates to systems, methods, and apparatus for facilitating the testing of a payload. An exemplary apparatus may include a fluid inlet port configured to receive fluid from a thermal subsystem of the payload. The apparatus may also include an actuating device configured to supply the fluid to a heat exchanger. A valve may be configured to receive the fluid from the heat exchanger and separate the fluid into a first fluid line and a second fluid line. A first fluid outlet port may be configured to supply the fluid to the thermal subsystem of the payload and a second fluid outlet port may be configured to supply the fluid to the thermal subsystem of the payload.
- Fluid inlet port to receive fluid from the thermal subsystem
- Actuating device to supply fluid to a heat exchanger
- Valve to separate fluid into first and second fluid lines
- First fluid outlet port to supply fluid to the thermal subsystem
- Second fluid outlet port to supply fluid to the thermal subsystem
Potential Applications: - Testing and validation of thermal subsystems in payloads - Research and development of thermal management systems - Quality control in manufacturing processes involving thermal components
Problems Solved: - Efficient testing and validation of thermal subsystems - Precise control of fluid flow in thermal management systems - Streamlining manufacturing processes for thermal components
Benefits: - Improved performance and reliability of thermal subsystems - Cost-effective testing and validation procedures - Enhanced quality control in manufacturing processes
Commercial Applications: Title: Thermal Subsystem Testing Apparatus for Aerospace Industry This technology can be utilized in aerospace companies for testing and validating thermal subsystems in payloads, ensuring optimal performance and reliability in mission-critical applications.
Prior Art: Readers can explore prior patents related to thermal management systems in aerospace applications to gain a deeper understanding of the technological advancements in this field.
Frequently Updated Research: Stay updated on the latest developments in thermal management systems for aerospace applications to incorporate cutting-edge technologies in payload testing and validation processes.
Questions about Thermal Subsystem Testing Apparatus: 1. How does the apparatus improve the efficiency of testing thermal subsystems? 2. What are the key advantages of using this technology in aerospace applications?
Original Abstract Submitted
The present application relates to systems, methods, and apparatus for facilitating the testing of a payload. An exemplary apparatus may include a fluid inlet port configured to receive fluid from a thermal subsystem of the payload. The apparatus may also include an actuating device configure to supply the fluid to a heat exchanger. A valve may be configured to receive the fluid from the heat exchanger and separate the fluid into a first fluid line and a second fluid line. A first fluid outlet port may be configured to supply the fluid to the thermal subsystem of the payload and a second fluid outlet port may be configured to supply the fluid to the thermal subsystem of payload.
