18060168. ISOLATED SUPER VIA TO MIDDLE METAL LINE LEVEL simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
Contents
- 1 ISOLATED SUPER VIA TO MIDDLE METAL LINE LEVEL
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 ISOLATED SUPER VIA TO MIDDLE METAL LINE LEVEL - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
ISOLATED SUPER VIA TO MIDDLE METAL LINE LEVEL
Organization Name
INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor(s)
Koichi Motoyama of Clifton Park NY (US)
Ruilong Xie of Niskayuna NY (US)
Nicholas Anthony Lanzillo of Wynantskill NY (US)
ISOLATED SUPER VIA TO MIDDLE METAL LINE LEVEL - A simplified explanation of the abstract
This abstract first appeared for US patent application 18060168 titled 'ISOLATED SUPER VIA TO MIDDLE METAL LINE LEVEL
Simplified Explanation
The abstract describes a patent application related to isolated self-aligned super vias, which includes a super via structure, a metallic line, and a dielectric fill material.
- Super via device comprises super via structure, metallic line, and dielectric fill material
- Dielectric fill material located between sidewalls of super via structure and metallic line
Potential Applications
The technology could be applied in the semiconductor industry for advanced integrated circuits and electronic devices.
Problems Solved
1. Improved signal transmission and reduced signal loss in electronic devices. 2. Enhanced reliability and performance of integrated circuits.
Benefits
1. Higher efficiency in signal transmission. 2. Increased reliability of electronic devices. 3. Enhanced performance of integrated circuits.
Potential Commercial Applications
Optimizing signal transmission in high-speed electronic devices for industries such as telecommunications, computing, and consumer electronics.
Possible Prior Art
Prior art may include similar patents or publications related to self-aligned vias and interconnect structures in semiconductor devices.
Unanswered Questions
How does this technology compare to existing methods of signal transmission in electronic devices?
The article does not provide a direct comparison between this technology and existing methods of signal transmission in electronic devices.
What are the potential limitations or challenges in implementing this technology on a large scale in semiconductor manufacturing?
The article does not address the potential limitations or challenges in implementing this technology on a large scale in semiconductor manufacturing.
Original Abstract Submitted
One or more systems, devices, and/or methods of fabrication provided herein relate to isolated self-aligned super vias. According to one embodiment, a super via device can comprise a super via structure, a metallic line and a dielectric fill material located between the sidewalls of the super via structure and the metallic line.
