18060125. INTEGRATED CIRCUIT PACKAGES INCLUDING A GLASS CORE WITH A FILTER STRUCTURE simplified abstract (Intel Corporation)

INTEGRATED CIRCUIT PACKAGES INCLUDING A GLASS CORE WITH A FILTER STRUCTURE

Organization Name

Intel Corporation

Inventor(s)

Jeremy Ecton of Gilbert AZ (US)

Aleksandar Aleksov of Chandler AZ (US)

Brandon C. Marin of Gilbert AZ (US)

Srinivas V. Pietambaram of Chandler AZ (US)

Hiroki Tanaka of Gilbert AZ (US)

INTEGRATED CIRCUIT PACKAGES INCLUDING A GLASS CORE WITH A FILTER STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18060125 titled 'INTEGRATED CIRCUIT PACKAGES INCLUDING A GLASS CORE WITH A FILTER STRUCTURE

Simplified Explanation

The patent application describes an integrated circuit (IC) package substrate with a glass core containing a cavity filter structure.

• Glass core with cavity filter structure:

   * The IC package substrate includes a core made of glass, with a first core portion having a trench and a ridge lined with a conductive material on its first surface.
   * A second core portion with a second surface lined with the conductive material is physically coupled to the first core portion, forming a cavity filter structure.

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1. 1. 1. Potential Applications of this Technology

• Telecommunications equipment
• Wireless communication devices
• Radar systems

1. 1. 1. Problems Solved by this Technology

• Improved signal filtering and interference reduction
• Enhanced performance of integrated circuits
• Increased reliability of electronic devices

1. 1. 1. Benefits of this Technology

• Higher signal quality
• Reduced electromagnetic interference
• Enhanced overall system performance

1. 1. 1. Potential Commercial Applications of this Technology
         1. Enhancing Signal Filtering in Integrated Circuits for Improved Performance

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1. 1. 1. Possible Prior Art

There may be prior art related to glass core substrates in electronic packaging, but specific examples are not provided in the patent application.

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1. 1. 1. Unanswered Questions
         1. How does the glass core substrate compare to traditional substrate materials in terms of cost and manufacturing processes?

The patent application does not address the cost implications or manufacturing differences between glass core substrates and other materials.

1. 1. 1. 1. What specific electronic devices or applications would benefit the most from the cavity filter structure described in the patent application?

The patent application does not provide information on the targeted electronic devices or applications that would see the greatest improvement from the cavity filter structure.

Original Abstract Submitted

An integrated circuit (IC) package substrate including a glass core having a cavity filter structure, and related devices and methods, are disclosed herein. In some embodiments, an IC package substrate may include a core made of glass, and the core including a first core portion having a first surface and a trench and a ridge in the first surface, the trench and the ridge lined with a conductive material; and a second core portion having a second surface, the second surface lined with the conductive material, wherein the first surface of the first core portion is physically coupled to the second surface of the second core portion forming a cavity filter structure.