18060106. INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED GLASS CORES simplified abstract (Intel Corporation)
Contents
- 1 INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED GLASS CORES
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED GLASS CORES - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED GLASS CORES
Organization Name
Inventor(s)
Soham Agarwal of Chandler AZ (US)
Benjamin T. Duong of Phoenix AZ (US)
INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED GLASS CORES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18060106 titled 'INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED GLASS CORES
Simplified Explanation
The patent application describes microelectronic assemblies with strengthened glass cores, conductive pathways, and dielectric materials. Here is a simplified explanation of the abstract:
- Glass core with varying ion concentrations
- Conductive pathway at the surface of the core
- Dielectric material with interconnects
- Electrical coupling between the core and dielectric
Potential Applications
The technology described in the patent application could be applied in various electronic devices such as smartphones, tablets, and computers.
Problems Solved
This technology solves the problem of providing a strong and reliable core material for microelectronic assemblies, enhancing their durability and performance.
Benefits
The benefits of this technology include improved strength and conductivity, leading to more efficient and reliable electronic devices.
Potential Commercial Applications
The technology could be utilized in the manufacturing of consumer electronics, medical devices, and industrial equipment.
Possible Prior Art
One possible prior art could be the use of traditional materials like silicon or metal for microelectronic assemblies.
Unanswered Questions
How does this technology compare to existing glass core technologies in terms of cost and performance?
The article does not provide information on the cost-effectiveness or performance comparison of this technology with existing glass core technologies.
What are the potential environmental impacts of using strengthened glass cores in microelectronic assemblies?
The article does not address the potential environmental impacts of using strengthened glass cores in microelectronic assemblies.
Original Abstract Submitted
Disclosed herein are microelectronic assemblies including strengthened glass cores, as well as related devices and methods. In some embodiments, a microelectronic assembly may include a core made of glass and having a surface, the core further including a first region having a first concentration of ions and a second region having a second concentration of ions at the surface of the core; and a third region having a third concentration of ions, wherein the second region is between the third region and the surface of the core, and wherein the third concentration of ions is less than the first and second concentrations of ions; a dielectric with a conductive pathway at the surface of the core; and a die electrically coupled to the conductive pathway in the dielectric at the surface of the core by an interconnect.
