18060080. INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED GLASS CORES simplified abstract (Intel Corporation)
INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED GLASS CORES
Organization Name
Inventor(s)
Benjamin T. Duong of Phoenix AZ (US)
Whitney Bryks of Tempe AZ (US)
Kristof Kuwawi Darmawikarta of Chandler AZ (US)
Srinivas V. Pietambaram of Chandler AZ (US)
Ravindranath Vithal Mahajan of Chandler AZ (US)
INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED GLASS CORES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18060080 titled 'INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED GLASS CORES
Simplified Explanation
The abstract describes a microelectronic assembly with a strengthened glass core, including regions with different concentrations of ions and a conductive pathway at the surface of the core.
- Strengthened glass core with different ion concentrations:
- Glass core has a first region with a lower concentration of ions and a second region with a higher concentration of ions. - The second region is between the first region and the surface of the core.
- Conductive pathway at the surface of the glass core:
- Dielectric material with a conductive pathway at the surface of the glass core. - Dielectric is electrically coupled to the conductive pathway by an interconnect.
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- Potential Applications
The technology described in this patent application could be applied in the following areas: - Microelectronics - Semiconductor devices - Integrated circuits
- Problems Solved
This technology addresses the following issues: - Strengthening glass cores in microelectronic assemblies - Enhancing conductivity and performance of microelectronic devices
- Benefits
The benefits of this technology include: - Improved durability and reliability of microelectronic assemblies - Enhanced electrical conductivity and signal transmission - Potential for miniaturization and increased functionality in electronic devices
- Potential Commercial Applications
The technology could have commercial applications in: - Consumer electronics - Telecommunications - Automotive electronics
- Possible Prior Art
One possible prior art could be the use of reinforced glass cores in microelectronic assemblies to improve strength and performance. Another could be the integration of conductive pathways at the surface of glass cores to enhance electrical connectivity.
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- Unanswered Questions
- How does this technology compare to existing methods for strengthening glass cores in microelectronic assemblies?
This article does not provide a direct comparison with existing methods for strengthening glass cores. Further research and testing may be needed to evaluate the effectiveness and efficiency of this technology compared to traditional methods.
- What are the potential limitations or challenges in implementing this technology in practical applications?
The article does not address potential limitations or challenges in implementing this technology. Factors such as cost, scalability, and compatibility with existing manufacturing processes could be important considerations that need to be explored further.
Original Abstract Submitted
Disclosed herein are microelectronic assemblies including strengthened glass cores, as well as related devices and methods. In some embodiments, a microelectronic assembly may include a glass core having a surface, a first region having a first concentration of ions extending from the surface of the core to a first depth; a second region having a second concentration of ions greater than the first concentration of ions, the second region between the first region and the surface of the core; a dielectric with a conductive pathway at the surface of the glass core; and a die electrically coupled to the conductive pathway in the dielectric at the surface of the core by an interconnect.
