18059993. METHOD AND APPARATUS FOR LAMINATING A FILM ON A SUBSTRATE simplified abstract (Intel Corporation)

METHOD AND APPARATUS FOR LAMINATING A FILM ON A SUBSTRATE

Organization Name

Intel Corporation

Inventor(s)

Joshua Stacey of Chandler AZ (US)

Thomas Heaton of Gilbert AZ (US)

Dilan Seneviratne of Phoenix AZ (US)

METHOD AND APPARATUS FOR LAMINATING A FILM ON A SUBSTRATE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18059993 titled 'METHOD AND APPARATUS FOR LAMINATING A FILM ON A SUBSTRATE

Simplified Explanation

The present disclosure is directed to an apparatus including a first laminating component configured to laminate a dry film onto a substrate using heat, and a focused cure module configured to selectively cure a first portion of the dry film without curing a second portion of the dry film. The first portion forms a perimeter that surrounds the second portion.

• Explanation:

   - Apparatus for laminating dry film onto a substrate.
   - Utilizes heat for lamination process.
   - Focused cure module selectively cures specific portions of the dry film.
   - First portion of dry film is cured to form a perimeter around the second portion.

• • Potential Applications:

  - Electronics manufacturing
  - Printed circuit board assembly
  - Semiconductor industry

• • Problems Solved:

  - Precise curing of specific areas of dry film
  - Enhanced control over lamination process
  - Improved quality and accuracy in manufacturing processes

• • Benefits:

  - Increased efficiency in production
  - Reduction in material waste
  - Enhanced product quality and consistency

• • Potential Commercial Applications:

  - Manufacturing equipment suppliers
  - Electronics industry
  - Research and development companies

• • Possible Prior Art:

  - Prior art related to selective curing methods in manufacturing processes
  - Previous patents on laminating components for substrates

• • Unanswered Questions:

• • • How does the apparatus ensure precise curing of the first portion of the dry film without affecting the second portion?

   - The apparatus likely utilizes a focused cure module with controlled parameters to target specific areas for curing.

• • • What are the specific industries that would benefit the most from this apparatus?

   - The electronics manufacturing industry, particularly in the production of printed circuit boards, would likely see significant benefits from this technology.

Original Abstract Submitted

The present disclosure is directed to an apparatus including a first laminating component configured to laminate a dry film onto a substrate using heat, and a focused cure module configured to selectively cure a first portion of the dry film without curing a second portion of the dry film. The first portion forms a perimeter that surrounds the second portion.