18059074. PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES simplified abstract (Intel Corporation)
Contents
- 1 PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES
Organization Name
Inventor(s)
Jeremy Ecton of Gilbert AZ (US)
Brandon C. Marin of Gilbert AZ (US)
Srinivas V. Pietambaram of Chandler AZ (US)
Suddhasattwa Nad of Chandler AZ (US)
PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18059074 titled 'PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES
Simplified Explanation
The patent application describes a photonic assembly that includes a substrate with a core made of glass, a dielectric material with conductive pathways on the core surface, a photonic integrated circuit (PIC) electrically coupled to the pathways, optical components, and optical pathways for coupling components.
- The photonic assembly includes a substrate with a glass core and a dielectric material with conductive pathways.
- A photonic integrated circuit (PIC) is electrically coupled to the conductive pathways in the dielectric material.
- Optical components are positioned between the PIC and the core surface, with optical pathways for coupling the components.
Potential Applications
The technology described in the patent application could be applied in:
- Telecommunications for high-speed data transmission.
- Optical computing for faster processing speeds.
Problems Solved
The technology addresses the following issues:
- Efficient data transmission over long distances.
- Integration of optical components in microelectronic assemblies.
Benefits
The technology offers the following benefits:
- Improved data transmission speeds.
- Enhanced performance of optical computing systems.
Potential Commercial Applications
The technology could be utilized in various commercial applications, such as:
- Data centers for high-speed data processing.
- Telecommunication networks for improved connectivity.
Possible Prior Art
One possible prior art could be the integration of optical components in microelectronic assemblies for data transmission applications.
Original Abstract Submitted
Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a photonic assembly may include a substrate having a core with a surface, wherein a material of the core includes glass; and a dielectric material on a portion of the surface of the core, the dielectric material including conductive pathways; a photonic integrated circuit (PIC) electrically coupled to the conductive pathways in the dielectric material; a first optical component between the PIC and the surface of the core, wherein the first optical component is along a perimeter of the core; and a second optical component coupled to the first optical component, wherein the second optical component is optically coupled to the PIC by an optical pathway through the first optical component.
