18058996. PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES simplified abstract (Intel Corporation)
Contents
- 1 PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES
Organization Name
Inventor(s)
Xiaoqian Li of Chandler AZ (US)
PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18058996 titled 'PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES
Simplified Explanation
The patent application describes a microelectronic assembly that includes a substrate with a glass core, a dielectric material with conductive pathways, a processor integrated circuit (XPU), a photonic integrated circuit (PIC), optical components, and optical pathways.
- Glass core substrate with dielectric material and conductive pathways
- Integration of processor integrated circuit (XPU) and photonic integrated circuit (PIC)
- Optical components optically coupled to the core and PIC
- Optical pathway through the core for communication between components
Potential Applications
The technology described in the patent application could be applied in:
- Telecommunications
- Data centers
- Optical computing
Problems Solved
The technology addresses challenges related to:
- Integration of electronic and photonic components
- Efficient communication between components
- Miniaturization of electronic devices
Benefits
The benefits of this technology include:
- Improved performance and speed of electronic devices
- Enhanced communication capabilities
- Reduction in size and weight of microelectronic assemblies
Potential Commercial Applications
The technology has potential commercial applications in:
- Telecommunications equipment
- Data center infrastructure
- High-performance computing systems
Possible Prior Art
One possible prior art for this technology could be the integration of electronic and photonic components in microelectronic assemblies, but the specific configuration and use of glass core substrate with optical components may be novel.
Unanswered Questions
How does this technology compare to existing solutions in terms of cost-effectiveness?
The patent application does not provide information on the cost-effectiveness of the technology compared to existing solutions. Further research or analysis would be needed to determine the cost implications of implementing this technology.
What are the potential scalability limitations of this technology?
The scalability limitations of the technology are not discussed in the patent application. It would be important to understand how easily this technology can be scaled up for mass production or larger applications.
Original Abstract Submitted
Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a substrate having a glass core with a surface and a dielectric material on a portion of the surface of the core, the dielectric material including conductive pathways and an interconnect die; a processor integrated circuit (XPU) and a photonic integrated circuit (PIC), having an active surface facing towards the core, electrically coupled to the interconnect die and to the conductive pathways; a first optical component optically coupled to the active surface of the PIC and to the surface of the core; and a second optical component coupled to the core, wherein the second optical component is optically coupled to the PIC by an optical pathway through the first optical component and the core.
