18058980. PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES simplified abstract (Intel Corporation)
Contents
- 1 PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES
Organization Name
Inventor(s)
Xiaoqian Li of Chandler AZ (US)
PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18058980 titled 'PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES
Simplified Explanation
The patent application describes a microelectronic assembly that includes a substrate with a glass core, a photonic integrated circuit (PIC), a processor integrated circuit (XPU), and optical components.
- Glass core substrate with dielectric material and conductive pathways
- Photonic integrated circuit (PIC) coupled to the core with active surface facing away
- Processor integrated circuit (XPU) electrically coupled to the PIC and dielectric material
- First optical component optically coupled to the PIC and core
- Second optical component optically coupled to the PIC through the core and first optical component
Potential Applications
This technology could be applied in telecommunications, data processing, and optical computing industries.
Problems Solved
This technology solves the problem of integrating photonic and electronic components in a compact and efficient manner.
Benefits
The benefits of this technology include improved performance, reduced size, and enhanced functionality of microelectronic assemblies.
Potential Commercial Applications
The potential commercial applications of this technology could include high-speed data processing systems, optical communication networks, and advanced computing devices.
Possible Prior Art
One possible prior art for this technology could be the integration of photonic and electronic components in microelectronic assemblies using traditional methods.
Unanswered Questions
How does this technology compare to existing microelectronic assembly methods?
This article does not provide a direct comparison to existing methods of microelectronic assembly, leaving the reader to wonder about the specific advantages and disadvantages of this new approach.
What are the specific performance metrics of this technology compared to traditional microelectronic assemblies?
The article does not delve into the specific performance metrics of this technology, leaving the reader curious about how it performs in terms of speed, efficiency, and reliability compared to traditional methods.
Original Abstract Submitted
Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a substrate having a glass core with a surface and a dielectric material on a portion of the surface of the core, the dielectric material including conductive pathways; a photonic integrated circuit (PIC) having an active surface, wherein the PIC is coupled to the surface of the core with the active surface facing away from the core; a processor integrated circuit (XPU) electrically coupled to the conductive pathways in the dielectric material and to the active surface of the PIC; a first optical component optically coupled to a lateral surface of the PIC and to the surface of the core; and a second optical component coupled to the core, wherein the second optical component is optically coupled to the PIC by an optical pathway through the first optical component and the core.
