18057397. APPARATUS FOR REMOVING A PHOTORESIST AND APPARATUS OF MANUFACTURING A SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
APPARATUS FOR REMOVING A PHOTORESIST AND APPARATUS OF MANUFACTURING A SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Hyun Jung Lee of Suwon-si (KR)
Yong-Jhin Cho of Suwon-si (KR)
APPARATUS FOR REMOVING A PHOTORESIST AND APPARATUS OF MANUFACTURING A SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18057397 titled 'APPARATUS FOR REMOVING A PHOTORESIST AND APPARATUS OF MANUFACTURING A SEMICONDUCTOR DEVICE
Simplified Explanation
The patent application describes an apparatus for fabricating a semiconductor device. Here is a simplified explanation of the abstract:
- The apparatus includes a nozzle with a slit that can eject a solution.
- An ultraviolet emitter is positioned outside the nozzle.
- Both the ultraviolet emitter and the nozzle can move horizontally.
- The slit is located on the bottom surface of the nozzle.
Potential applications of this technology:
- Fabrication of semiconductor devices.
- Manufacturing of integrated circuits.
- Production of electronic components.
Problems solved by this technology:
- Precise and controlled ejection of solution onto semiconductor devices.
- Enhanced efficiency in the fabrication process.
- Improved accuracy in the deposition of materials.
Benefits of this technology:
- Increased productivity and throughput in semiconductor manufacturing.
- Improved quality and reliability of fabricated devices.
- Cost savings due to optimized material usage and reduced waste.
Original Abstract Submitted
An apparatus for fabricating a semiconductor device may include a nozzle having a slit configured to eject solution and an ultraviolet emitter provided outside the nozzle. The ultraviolet emitter and the nozzle may be configured to move horizontally. The slit may be provided on a bottom surface of the nozzle.
