18055605. PACKAGE ARCHITECTURE WITH MICROFLUIDIC CHANNELS IN GLASS SUBSTRATES simplified abstract (Intel Corporation)

PACKAGE ARCHITECTURE WITH MICROFLUIDIC CHANNELS IN GLASS SUBSTRATES

Organization Name

Intel Corporation

Inventor(s)

Brandon C. Marin of Gilbert AZ (US)

Gang Duan of Chandler AZ (US)

Jeremy Ecton of Gilbert AZ (US)

Sashi Shekhar Kandanur of Phoenix AZ (US)

Ravindranath Vithal Mahajan of Chandler AZ (US)

Suddhasattwa Nad of Chandler AZ (US)

Srinivas V. Pietambaram of Chandler AZ (US)

Hiroki Tanaka of Gilbert AZ (US)

PACKAGE ARCHITECTURE WITH MICROFLUIDIC CHANNELS IN GLASS SUBSTRATES - A simplified explanation of the abstract

This abstract first appeared for US patent application 18055605 titled 'PACKAGE ARCHITECTURE WITH MICROFLUIDIC CHANNELS IN GLASS SUBSTRATES

Simplified Explanation

The abstract describes a microelectronic assembly with an interposer, two integrated circuit (IC) dies, and a glass substrate with a channel for electrical connections.

• The interposer has a first portion with an embedded IC die and a second portion with a glass substrate containing a channel.
• The second IC die is coupled to the interposer opposite to the second portion, with a conductive pad connecting it to a circuit in one of the IC dies.
• The glass substrate in the second portion has an opening at the interface, exposing the conductive pad for connection.

Potential Applications

This technology could be used in:

• High-performance computing systems
• Advanced communication devices
• Automotive electronics

Problems Solved

This technology addresses:

• Improved electrical connections in microelectronic assemblies
• Enhanced thermal management for IC dies
• Increased reliability and performance of electronic devices

Benefits

The benefits of this technology include:

• Higher efficiency in data processing
• Reduced heat generation in electronic components
• Longer lifespan of microelectronic assemblies

Potential Commercial Applications

The potential commercial applications of this technology include:

• Data centers and server farms
• Telecommunications infrastructure
• Automotive industry for advanced driver-assistance systems

Possible Prior Art

One possible prior art for this technology could be the use of interposers in microelectronic assemblies for improved connectivity and thermal management.

How does this technology impact the overall cost of microelectronic assemblies?

This article does not address the cost implications of implementing this technology. It would be important to understand if the benefits outweigh the potential increase in production costs.

What are the environmental implications of using glass substrates in microelectronic assemblies?

The abstract does not mention any environmental considerations related to the use of glass substrates. It would be valuable to explore the sustainability aspects of this technology, such as the recyclability of materials used.

Original Abstract Submitted

Embodiments of a microelectronic assembly includes: an interposer comprising a first portion in contact along an interface with a second portion; a first integrated circuit (IC) die embedded in a dielectric material in the first portion of the interposer; and a second IC die coupled to the first portion of the interposer opposite to the second portion, wherein: the second portion comprises a glass substrate with a channel within the glass substrate, a portion of the channel has an opening at the interface, a conductive pad in the first portion is exposed in the opening, and the conductive pad is coupled to a circuit in at least one of the first IC die or the second IC die.