18054021. PARTICLE REMOVAL METHOD, PARTICLE REMOVAL APPARATUS, AND METHOD FOR MANUFACTURING ARTICLE simplified abstract (CANON KABUSHIKI KAISHA)

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PARTICLE REMOVAL METHOD, PARTICLE REMOVAL APPARATUS, AND METHOD FOR MANUFACTURING ARTICLE

Organization Name

CANON KABUSHIKI KAISHA

Inventor(s)

Masami Yonekawa of Tochigi (JP)

Tomohiro Saito of Tochigi (JP)

Hisanobu Azuma of Kanagawa (JP)

PARTICLE REMOVAL METHOD, PARTICLE REMOVAL APPARATUS, AND METHOD FOR MANUFACTURING ARTICLE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18054021 titled 'PARTICLE REMOVAL METHOD, PARTICLE REMOVAL APPARATUS, AND METHOD FOR MANUFACTURING ARTICLE

Simplified Explanation

Abstract: A curable composition is applied to a substrate and cured while in contact with a member. The member is then separated from the substrate, removing the cured composition and any particles present.

  • The curable composition is applied to a substrate.
  • A member is placed in contact with the curable composition.
  • The composition is cured while the member is in contact with it.
  • The member is separated from the substrate.
  • The cured composition and any particles are removed from the substrate.

Potential Applications:

  • Manufacturing processes where the removal of cured compositions and particles from a substrate is required.
  • Coating applications where a member is used to facilitate the curing process.

Problems Solved:

  • Efficient removal of cured compositions and particles from a substrate.
  • Simplification of manufacturing processes involving curable compositions.

Benefits:

  • Improved cleanliness and quality of the substrate after the removal of cured compositions and particles.
  • Streamlined manufacturing processes, reducing time and costs.


Original Abstract Submitted

A curable composition on a substrate is cured in a state where a member is in contact with the curable composition. Thereafter, the member having adhered to the curable composition is separated from the substrate, whereby the curable composition and a particle are removed from the substrate.

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