18047670. SEMICONDUCTOR DEVICE WITH THERMAL DISSIPATION AND METHOD THEREFOR simplified abstract (NXP B.V.)
Contents
SEMICONDUCTOR DEVICE WITH THERMAL DISSIPATION AND METHOD THEREFOR
Organization Name
Inventor(s)
Frank.zy Guo of Kaohsiung (TW)
Yi-Tien Liao of Kaohsiung (TW)
SEMICONDUCTOR DEVICE WITH THERMAL DISSIPATION AND METHOD THEREFOR - A simplified explanation of the abstract
This abstract first appeared for US patent application 18047670 titled 'SEMICONDUCTOR DEVICE WITH THERMAL DISSIPATION AND METHOD THEREFOR
The method described in the patent application involves attaching a semiconductor die to a package leadframe by connecting die pads to central and peripheral regions of the leadframe, respectively, and encapsulating the assembly.
- The first die pad of the semiconductor die is attached to the central pad of the package leadframe.
- The second die pad of the semiconductor die is connected to a lead of the package leadframe.
- The encapsulant covers a portion of the semiconductor die and leadframe, leaving the backside surfaces exposed at the top and bottom major surfaces of the encapsulant.
Potential Applications: - Semiconductor manufacturing - Electronics industry - Integrated circuit packaging
Problems Solved: - Efficient attachment of semiconductor dies to leadframes - Ensuring proper electrical connections between die pads and leadframes - Protecting the semiconductor die during packaging
Benefits: - Improved reliability of semiconductor devices - Enhanced electrical performance - Cost-effective manufacturing process
Commercial Applications: Title: Advanced Semiconductor Device Manufacturing Process This technology can be utilized in the production of various electronic devices, such as smartphones, computers, and automotive electronics. The streamlined manufacturing process can lead to cost savings and improved product quality.
Questions about the technology: 1. How does this method compare to traditional semiconductor packaging techniques? - Answer: This method offers improved efficiency and reliability compared to traditional techniques by ensuring proper attachment and encapsulation of the semiconductor die. 2. What are the potential challenges in scaling up this manufacturing process for mass production? - Answer: Scaling up may require optimization of equipment and processes to maintain consistency and quality in large-scale production.
Original Abstract Submitted
A method of manufacturing a semiconductor device is provided. The method includes attaching a first die pad of a semiconductor die to a central pad of a package leadframe. The first die pad is located in a central region on an active side of the semiconductor die. A second die pad of the semiconductor die is connected a lead of the package lead frame. The second die pad is located in a periphery region on the active side of the semiconductor die. An encapsulant encapsulates a portion of the semiconductor die and a portion of the package leadframe. A backside surface of the semiconductor die is exposed at a top major surface of the encapsulant, and a backside surface of the central pad exposed at a bottom major surface of the encapsulant.
