18044320. LIGHT-EMITTING MODULE AND METHOD OF MANUFACTURING THE SAME, DISPLAY APPARATUS simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)

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LIGHT-EMITTING MODULE AND METHOD OF MANUFACTURING THE SAME, DISPLAY APPARATUS

Organization Name

BOE TECHNOLOGY GROUP CO., LTD.

Inventor(s)

Hui Yu of Beijing (CN)

Han Zhang of Beijing (CN)

Qifei Chen of Beijing (CN)

Dingjie Zheng of Beijing (CN)

Ming Chen of Beijing (CN)

Laiyou Cui of Beijing (CN)

Chengkun Liu of Beijing (CN)

LIGHT-EMITTING MODULE AND METHOD OF MANUFACTURING THE SAME, DISPLAY APPARATUS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18044320 titled 'LIGHT-EMITTING MODULE AND METHOD OF MANUFACTURING THE SAME, DISPLAY APPARATUS

Simplified Explanation: The patent application describes a light-emitting module with a carrier substrate, a light-emitting circuit layer, a backboard, a mounting cavity, and connection members.

Key Features and Innovation:

  • Light-emitting circuit layer on carrier substrate
  • Backboard in contact with carrier substrate
  • Mounting cavity enclosed by backboard and carrier substrate
  • Connection member fixedly connected to carrier substrate and backboard

Potential Applications: This technology could be used in various lighting applications, such as in displays, signage, and automotive lighting.

Problems Solved: The technology addresses the need for a reliable and efficient light-emitting module design that ensures secure connections between components.

Benefits:

  • Enhanced reliability in light-emitting modules
  • Secure connections between components
  • Efficient design for various applications

Commercial Applications: The technology could have commercial applications in the display industry, automotive lighting sector, and general lighting applications.

Prior Art: Readers interested in prior art related to this technology could start by researching patents in the field of light-emitting modules and display technologies.

Frequently Updated Research: Stay updated on advancements in light-emitting module technology, materials science, and display technologies for potential improvements in this field.

Questions about Light-Emitting Modules: 1. What are the key components of a light-emitting module?

  - A light-emitting module typically consists of a carrier substrate, light-emitting circuit layer, backboard, mounting cavity, and connection members.

2. How does the design of a light-emitting module impact its performance and reliability?

  - The design of a light-emitting module plays a crucial role in ensuring optimal performance and reliability in various applications.


Original Abstract Submitted

A light-emitting module includes a carrier substrate, a first light-emitting circuit layer, a backboard, a mounting cavity and at least one connection member. The first light-emitting circuit layer is disposed on the carrier substrate. The backboard is disposed on a side of the carrier substrate away from the first light-emitting circuit layer and is in contact with the carrier substrate. The mounting cavity is disposed in at least one of the backboard and the carrier substrate, and an inner wall of the mounting cavity is enclosed by both the backboard and the carrier substrate. A connection member is disposed in the mounting cavity and fixedly connected to the carrier substrate and the backboard.