18043840. Electronic Device simplified abstract (Honor Device Co., Ltd.)
Contents
Electronic Device
Organization Name
Inventor(s)
Shaohong Dong of Shenzhen (CN)
Electronic Device - A simplified explanation of the abstract
This abstract first appeared for US patent application 18043840 titled 'Electronic Device
The abstract describes an electronic device with a shielding assembly that includes a thermally conductive plate and a capillary structure to manage the working substance flow.
- The electronic device comprises a mainboard, electronic components, and a shielding assembly.
- The shielding assembly consists of a shielding case, a capillary structure, and a thermally conductive plate.
- Electronic components are housed in the shielding case and connected to it.
- The thermally conductive plate forms a sealing cavity with the shielding case and is positioned away from the electronic components.
- The capillary structure within the sealing cavity enables the working substance to flow from the condensation zone to the vaporization zone.
- The sealing cavity is filled with a working substance and includes a vaporization zone and a condensation zone.
Potential Applications: - This technology can be applied in electronic devices to improve thermal management and enhance performance. - It can be utilized in high-power electronic systems to prevent overheating and ensure reliability.
Problems Solved: - Addresses thermal issues in electronic devices by efficiently managing heat dissipation. - Enhances the longevity and stability of electronic components by maintaining optimal operating temperatures.
Benefits: - Improved thermal performance and reliability of electronic devices. - Enhanced efficiency and longevity of electronic components. - Reduced risk of overheating and potential damage to electronic systems.
Commercial Applications: Title: Advanced Thermal Management System for Electronic Devices This technology can be commercialized in various industries such as consumer electronics, telecommunications, automotive, and aerospace for applications requiring efficient thermal management solutions.
Questions about the technology: 1. How does the capillary structure facilitate the flow of the working substance in the sealing cavity? 2. What are the key advantages of using a thermally conductive plate in the shielding assembly?
Original Abstract Submitted
An embodiment of this application provides an electronic device. The electronic device includes at least a mainboard, electronic components, and a shielding assembly. The shielding assembly includes a shielding case, a capillary structure, and a thermally conductive plate. The electronic components are located in the shielding case and connected to the shielding case. The thermally conductive plate is located on a side of the shielding case that faces away from the electronic components. The thermally conductive plate is connected to the shielding case to form a sealing cavity. The capillary structure is disposed in the sealing cavity. The sealing cavity is filled with a working substance. The sealing cavity includes a vaporization zone and a condensation zone. The vaporization zone is located above the electronic components. The capillary structure is configured to enable the working substance to back flow from the condensation zone to the vaporization zone.
