18028299. ARRAY SUBSTRATE AND ELECTRONIC APPARATUS (BOE TECHNOLOGY GROUP CO., LTD.)
Contents
ARRAY SUBSTRATE AND ELECTRONIC APPARATUS
Organization Name
BOE TECHNOLOGY GROUP CO., LTD.
Inventor(s)
ARRAY SUBSTRATE AND ELECTRONIC APPARATUS
This abstract first appeared for US patent application 18028299 titled 'ARRAY SUBSTRATE AND ELECTRONIC APPARATUS
Original Abstract Submitted
Provided are an array substrate and an electronic apparatus. The array substrate includes: a base substrate; a first conductive layer on the base substrate, where the first conductive layer includes a plurality of pads, each pad includes a first metal layer, a material of the first metal layer includes Cu, a content of the Cu is greater than or equal to 99%, and a thickness of the first metal layer is greater than 2 μm; and an electronic element disposed on a side of the first conductive layer facing away from the base substrate, where the electronic element includes an electronic element body and a plurality of pins disposed on a side of the electronic element body facing the base substrate, and the pins are connected with the pads.
